PCB and laminated DBC hybrid packaging half-bridge type power module (Chinese)
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2022
- Patent / Electronic Resource
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Title:PCB and laminated DBC hybrid packaging half-bridge type power module
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Additional title:一种PCB+叠层DBC混合封装半桥型功率模块
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Patent number:CN115172357
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Publication date:2022-10-11
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
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