Cutting-up method of gallium arsenide wafer (Chinese)
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2023
- Patent / Electronic Resource
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Title:Cutting-up method of gallium arsenide wafer
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Additional title:砷化镓晶圆的划切方法
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Patent number:CN116387143
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Patent applicant:
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Patent family:
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Contributors:ZHANG XINGHUA ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-07-04
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: