High-efficiency water-saving type semiconductor wafer pickling device (Chinese)
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- New search for: WANG LIMING
- New search for: WANG LIMING
2023
- Patent / Electronic Resource
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Title:High-efficiency water-saving type semiconductor wafer pickling device
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Additional title:一种高效节水型半导体晶圆酸洗装置
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Patent number:CN116525527
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Patent applicant:
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Patent family:
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Contributors:WANG LIMING ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-08-01
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: