Electronic assembly having circuit carrier, semiconductor chip and heat sink (Chinese)
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- New search for: FEIL WERNER
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2023
- Patent / Electronic Resource
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Title:Electronic assembly having circuit carrier, semiconductor chip and heat sink
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Additional title:具有电路载体、半导体芯片和散热器的电子组件
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Patent number:CN117203760
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Patent applicant:
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Patent family:
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Contributors:FEIL WERNER ( author ) / KIEFER STEPHAN ( author ) / SCHALLER KARL-HEINZ ( author ) / STEGMAIER STEFAN ( author ) / VOLLMER HARALD ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-12-08
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: