LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES (English)
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- New search for: MARTINEZ SERGIO V
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2023
- Patent / Electronic Resource
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Title:LOW COST METHOD FOR DEPOSITING SOLDER OR ADHESIVE IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES
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Additional title:KOSTENGÜNSTIGES VERFAHREN ZUM AUFBRINGEN VON LOT ODER KLEBSTOFF IN EIN MUSTER ZUR BILDUNG ELEKTRONISCHER ANORDNUNGEN
PROCÉDÉ ÉCONOMIQUE DE DÉPÔT DE SOUDURE OU D'ADHÉSIF DANS UN MOTIF POUR FORMER DES ENSEMBLES ÉLECTRONIQUES -
Patent number:EP4216683
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- New search for: Europäisches Patentamt
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Publication date:2023-07-26
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
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