PHOTOSENSITIVE RESIN COMPOSITION (Japanese)
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2015
- Patent / Electronic Resource
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Title:PHOTOSENSITIVE RESIN COMPOSITION
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Additional title:感光性樹脂組成物
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Patent number:JP2015172664
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Patent applicant:
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Patent family:
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Contributors:
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2015-10-01
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Japanese
- New search for: G03F / C08G / H05K
- Further information on International Patent Classification
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Classification:
IPC: G03F Fotomechanische Herstellung strukturierter oder gemusterter Oberflächen, z.B. zum Drucken, zum Herstellen von Halbleiterbauelementen, PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES / C08G MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS, Makromolekulare Verbindungen, anders erhalten als durch Reaktionen, an denen nur ungesättigte Kohlenstoff-Kohlenstoff-Bindungen beteiligt sind / H05K PRINTED CIRCUITS, Gedruckte Schaltungen -
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