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Title:高アスペクト比構造のセグメンテーションまたは断面
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Patent number:JP2024516176
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Patent family:
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2024-04-12
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Japanese
- New search for: H01L / G06T / G06V / H01J
- Further information on International Patent Classification
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Classification:
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Source: