SEMICONDUCTOR STRUCTURE WITH INSERTION LAYER AND METHOD FOR MANUFACTURING THE SAME (Korean)
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2017
- Patent / Electronic Resource
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Title:SEMICONDUCTOR STRUCTURE WITH INSERTION LAYER AND METHOD FOR MANUFACTURING THE SAME
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Additional title:삽입 층을 구비한 반도체 구조체 및 이를 제조하는 방법
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Patent number:KR20170128170
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Patent applicant:
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Patent family:
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Contributors:LIAN CHENG WEI ( author ) / WANG CHIH LIN ( author ) / KUO KANG MIN ( author ) / LIN CHIH WEI ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2017-11-22
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Korean
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: