- 3 3D Semiconductor Integrated Circuit Device Including Inter-Die Interface (Korean)
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2024
- Patent / Electronic Resource
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Title:- 3 3D Semiconductor Integrated Circuit Device Including Inter-Die Interface
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Additional title:인터-다이 인터페이스를 포함하는 3차원 반도체 집적 회로 장치
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Patent number:KR20240050090
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Patent applicant:
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Patent family:
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Contributors:CHOI JAE SEUNG ( author ) / KIM BYUNG SU ( author ) / PARK BONG IL ( author ) / KWAK CHANG SEOK ( author ) / PARK SUN HEE ( author ) / CHEON SANG JOON ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2024-04-18
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Korean
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: