Through substrate via liner densification (English)
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- New search for: LU JIN
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- New search for: LU JIN
- New search for: KLEIN RITA J
- New search for: TRAN DIEM THY N
- New search for: VASILYEVA IRINA V
- New search for: XIE ZHIQIANG
2018
- Patent / Electronic Resource
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Title:Through substrate via liner densification
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Patent number:US10163655
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Patent applicant:
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Patent family:
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Contributors:LU JIN ( author ) / KLEIN RITA J ( author ) / TRAN DIEM THY N ( author ) / VASILYEVA IRINA V ( author ) / XIE ZHIQIANG ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2018-12-25
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: