Die-on-interposer assembly with dam structure and method of manufacturing the same (English)
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2022
- Patent / Electronic Resource
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Title:Die-on-interposer assembly with dam structure and method of manufacturing the same
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Patent number:US11488882
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Patent applicant:
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Patent family:
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Contributors:
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2022-11-01
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
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