Systems and methods for mitigating crack propagation in semiconductor die manufacturing (English)
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2023
- Patent / Electronic Resource
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Title:Systems and methods for mitigating crack propagation in semiconductor die manufacturing
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Patent number:US11637040
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Patent applicant:
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Patent family:
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Contributors:NG WEI YEENG ( author ) / BALACHANDRAN RAJESH ( author ) / SPEETJENS FRANK ( author ) / LI ANDREW L ( author ) / KAUR SUKHDEEP ( author ) / KOMANDURI SANGEETHA P ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-04-25
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
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