WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF (English)
Free access
- New search for: JIN YU-FENG
- New search for: MA SHENG-LIN
- New search for: ZHAO QIAN-CHENG
- New search for: CHIU YI-HSIANG
- New search for: LIU HUAN
- New search for: LEE HUNG-PING
- New search for: GONG DAN
- New search for: JIN YU-FENG
- New search for: MA SHENG-LIN
- New search for: ZHAO QIAN-CHENG
- New search for: CHIU YI-HSIANG
- New search for: LIU HUAN
- New search for: LEE HUNG-PING
- New search for: GONG DAN
2020
- Patent / Electronic Resource
-
Title:WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF
-
Patent number:US2020179979
-
Patent applicant:
-
Patent family:
-
Contributors:JIN YU-FENG ( author ) / MA SHENG-LIN ( author ) / ZHAO QIAN-CHENG ( author ) / CHIU YI-HSIANG ( author ) / LIU HUAN ( author ) / LEE HUNG-PING ( author ) / GONG DAN ( author )
-
Publisher:
- New search for: Europäisches Patentamt
-
Publication date:2020-06-11
-
Type of media:Patent
-
Type of material:Electronic Resource
-
Language:English
- New search for: B06B / G06K / H01L
- Further information on International Patent Classification
-
Classification:
-
Source: