Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies (English)
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2020
- Patent / Electronic Resource
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Title:Integrated Assemblies Having Shield Lines Between Digit Lines, and Methods of Forming Integrated Assemblies
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Patent number:US2020286895
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Patent applicant:
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Patent family:
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Contributors:TANG SANH D ( author ) / PULUGURTHA SRINIVAS ( author ) / HILL RICHARD J ( author ) / GAO YUNFEI ( author ) / TAPIAS NICHOLAS R ( author ) / YANG LITAO ( author ) / LIU HAITAO ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2020-09-10
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: