Bonded Assembly, And Ceramic Circuit Substrate And Semiconductor Device Using The Same (English)
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- New search for: YAMAMOTO SHOTA
- New search for: YOSHIMURA FUMIHIKO
- New search for: SUENAGA SEIICHI
- New search for: OOZEKI TOMOYUKI
- New search for: YAMAMOTO SHOTA
- New search for: YOSHIMURA FUMIHIKO
- New search for: SUENAGA SEIICHI
- New search for: OOZEKI TOMOYUKI
2023
- Patent / Electronic Resource
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Title:Bonded Assembly, And Ceramic Circuit Substrate And Semiconductor Device Using The Same
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Patent number:US2023202137
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Patent applicant:
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Patent family:
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Contributors:YAMAMOTO SHOTA ( author ) / YOSHIMURA FUMIHIKO ( author ) / SUENAGA SEIICHI ( author ) / OOZEKI TOMOYUKI ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2023-06-29
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: B32B / C04B / H01L
- Further information on International Patent Classification
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Classification:
IPC: B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM, Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / C04B Kalk, LIME / H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
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