INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS (English)
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2024
- Patent / Electronic Resource
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Title:INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS BOUND BY GATE CUTS
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Patent number:US2024105804
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Patent applicant:
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Patent family:
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Contributors:GULER LEONARD P ( author ) / PURSEL SEAN ( author ) / LAVRIC DAN S ( author ) / GARDINER ALLEN B ( author ) / HINKE JONATHAN ( author ) / CHUNG WONIL ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2024-03-28
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: