Bump pad structure (English)
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2015
- Patent / Electronic Resource
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Title:Bump pad structure
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Patent number:US9171811
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Patent applicant:
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Patent family:
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Contributors:TSAI HAO-YI ( author ) / CHEN HSIEN-WEI ( author ) / LIU YU-WEN ( author ) / CHEN YING-JU ( author ) / WEI HSIU-PING ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2015-10-27
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: