Method of fabricating connection structure for a substrate (English)
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- New search for: LIN CHIH-SHENG
- New search for: CHEN CHUN-LUNG
- New search for: LEE HSIN-HUNG
- New search for: LIN CHIH-SHENG
- New search for: CHEN CHUN-LUNG
- New search for: LEE HSIN-HUNG
2017
- Patent / Electronic Resource
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Title:Method of fabricating connection structure for a substrate
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Patent number:US9666548
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Patent applicant:
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Patent family:
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- New search for: Europäisches Patentamt
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Publication date:2017-05-30
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: C25D / C23C / H01L / H05K
- Further information on International Patent Classification
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Classification:
IPC: C25D Verfahren für die elektrolytische oder elektrophoretische Herstellung von Überzügen, PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS / C23C Beschichten metallischer Werkstoffe, COATING METALLIC MATERIAL / H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS, Gedruckte Schaltungen -
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