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It is an object of the present invention to provide a simple interlock structure which extends into and utilizes the wall structure of the main vacuum chamber in its operation. It is a further object to provide such an interlock wherein the part entering and leaving the vacuum is placed directly in the main chamber and is easily accessable once the interlock is open on the vacuum side. And further, an object is to provide a fully demountable interlock assembly such that any or all parts can be removed from the chamber for repair or replacement and such that the interlock can be installed in any suitably prepared opposed openings in the vacuum chamber. The interlock is to be bakeable to 400 C. and to this end incorporates a metal-to-metal sealing system in the vacuum valve portion of the interlock.