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The results of a literature survey on the elevated temperature thermal, mechanical, and electrical properties of Teflon and Kel-F are presented. Data on the following elevated temperature properties of these materials are reported: specific heat, thermal expansion, decomposition rate and decomposition products, specific volume, mechanical and electrical properties. The available data clearly indicate that at elevated temperatures Teflon is superior in thermal stability and mechanical properties to Kel-F. As was anticipated, new, unpublished elevated temperature data on thermal expansion and specific heat of Teflon, and specific volume of Kel-F were uncovered, thereby eliminating the need for further experimental measurements of these properties. Room temperature data on Duroid 5600, a material consisting of Teflon reinforced with glass fibers, are also included because by fiber reinforcement, the usefulness of Teflon may be extended at elevated temperatures. There are no elevated temperature data available on this material at the present time. (Author)