Challenges of data center thermal management (English)
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In:
IBM Journal of Research and Development
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49
, 4/5
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709-723
;
2005
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ISSN:
- Article (Journal) / Print
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Title:Challenges of data center thermal management
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Contributors:
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Published in:IBM Journal of Research and Development ; 49, 4/5 ; 709-723
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Publisher:
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Publication date:2005
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Size:15 Seiten, 9 Bilder, 5 Tabellen, 31 Quellen
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ISSN:
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Coden:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 49, Issue 4/5
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 503
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POWER5 - PrefaceTendler, J.M. et al. | 2005
- 505
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POWER5 system microarchitectureSinharoy, B. / Kalla, R. N. / Tendler, J. M. / Eickemeyer, R. J. / Joyner, J. B. et al. | 2005
- 505
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POWER5 - POWER5 system microarchitectureSinharoy, B. et al. | 2005
- 523
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POWER5 - Advanced virtualization capabilities of POWER5 systemsArmstrong, W.J. et al. | 2005
- 523
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Advanced virtualization capabilities of POWER5 systemsArmstrong, W. J. / Arndt, R. L. / Boutcher, D. C. / Kovacs, R. G. / Larson, D. / Lucke, K. A. / Nayar, N. / Swanberg, R. C. et al. | 2005
- 533
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Operating system exploitation of the POWER5 systemMackerras, P. / Mathews, T. S. / Swanberg, R. C. et al. | 2005
- 533
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POWER5 - Operating system exploitation of the POWER5 systemMackerras, P. et al. | 2005
- 541
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POWER5 - Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systemsVictor, D.W. et al. | 2005
- 541
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Functional verification of the POWER5 microprocessor and POWER5 multiprocessor systemsVictor, D. W. / Ludden, J. M. / Peterson, R. D. / Nelson, B. S. / Sharp, W. K. / Hsu, J. K. / Chu, B.-L. / Behm, M. L. / Gott, R. M. / Romonosky, A. D. et al. | 2005
- 555
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Characterization of simultaneous multithreading (SMT) efficiency in POWER5Mathis, H. M. / Mericas, A. E. / McCalpin, J. D. / Eickemeyer, R. J. / Kunkel, S. R. et al. | 2005
- 555
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POWER5 - Characterization of simultaneous multithreading (SMT) efficiency in POWER5Mathis, H.M. et al. | 2005
- 555
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Characterization of simultaneous multithreading (SMT) efficieny in POWER5Mathis, Harry M. / Mericas, Alex E. / McCalpin, John D. / Eickemeyer, Richard J. / Kunkel, Steven R. et al. | 2005
- 565
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Functional formal verification on designs of pSeries microprocessors and communication subsystemsGott, R. M. / Baumgartner, J. R. / Roessler, P. / Joe, S. I. et al. | 2005
- 565
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POWER5 - Functional formal verification on designs of pSeries microprocessors and communication subsystemsGott, R.M. et al. | 2005
- 581
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Using microcode in the functional verification of an I/O chipGoldman, S. P. / Mohr, L. M. / Smith, D. R. et al. | 2005
- 581
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POWER5 - Using microcode in the functional verification of an I-O chipGoldman, S.P. et al. | 2005
- 589
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Introduction to the Cell multiprocessorKahle, J. A. / Day, M. N. / Hofstee, H. P. / Johns, C. R. / Maeurer, T. R. / Shippy, D. et al. | 2005
- 589
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POWER5 - Introduction to the Cell multiprocessorKahle, J.A. et al. | 2005
- 605
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Packaging - PrefaceFrase, K.G. et al. | 2005
- 607
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Packaging - Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applicationsKang, S.K. et al. | 2005
- 607
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Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applicationsKang, S. K. / Lauro, P. A. / Shih, D.-Y. / Henderson, D. W. / Puttlitz, K. J. et al. | 2005
- 621
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Packaging - Low-cost wafer bumpingGruber, P.A. et al. | 2005
- 621
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Low-cost wafer bumpingGruber, P. A. / Belanger, L. / Brouillette, G. P. / Danovitch, D. H. / Landreville, J.-L. / Naugle, D. T. / Oberson, V. A. / Shih, D.-Y. / Tessler, C. L. / Turgeon, M. R. et al. | 2005
- 641
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The evolution of build-up package technology and its design challengesBlackshear, E. D. / Cases, M. / Klink, E. / Engle, S. R. / Malfatt, R. S. / de Araujo, D. N. / Oggioni, S. / LaCroix, L. D. / Wakil, J. A. / Hougham, G. G. et al. | 2005
- 641
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Packaging - The evolution of build-up package technology and its design challengesBlackshear, E.D. et al. | 2005
- 663
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Packaging - Effects of mechanical stress and moisture on packaging interfacesBuchwalter, S.L. et al. | 2005
- 663
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Effects of mechanical stress and moisture on packaging interfacesBuchwalter, S. L. / Brofman, P. J. / Feger, C. / Gaynes, M. A. / Lee, K.-W. / Matienzo, L. J. / Questad, D. L. et al. | 2005
- 677
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Packaging - Latent defect screening for high-reliability glass-ceramic multichip module copper interconnectsYarmchuk, E.J. et al. | 2005
- 677
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Latent defect screening for high-reliability glass-ceramic multichip module copper interconnectsYarmchuk, E. J. / Cline, C. W. / Bruen, D. C. et al. | 2005
- 687
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Packaging - High-speed electrical testing of multichip ceramic modulesManzer, D.G. et al. | 2005
- 687
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High-speed electrical testing of multichip ceramic modulesManzer, D. G. / Karidis, J. P. / Wiley, K. M. / Bruen, D. C. / Cline, C. W. / Hendricks, C. / Wiggin, R. N. / Yu, Y.-Y. et al. | 2005
- 699
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Packaging - Mixing, rheology, and stability of highly filled thermal pastesFeger, C. et al. | 2005
- 699
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Mixing, rheology, and stability of highly filled thermal pastesFeger, C. / Gelorme, J. D. / McGlashan-Powell, M. / Kalyon, D. M. et al. | 2005
- 709
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Challenges of data center thermal managementSchmidt, R. R. / Cruz, E. E. / Iyengar, M. K. et al. | 2005
- 709
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Packaging - Challenges of data center thermal managementSchmidt, R.R. et al. | 2005
- 725
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnectionKnickerbocker, J. U. / Andry, P. S. / Buchwalter, L. P. / Deutsch, A. / Horton, R. R. / Jenkins, K. A. / Kwark, Y. H. / McVicker, G. / Patel, C. S. / Polastre, R. J. et al. | 2005
- 725
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Packaging - Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnectionKnickerbocker, J.U. et al. | 2005
- 755
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Exploitation of optical interconnects in future server architecturesBenner, A. F. / Ignatowski, M. / Kash, J. A. / Kuchta, D. M. / Ritter, M. B. et al. | 2005
- 755
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Packaging - Exploitation of optical interconnects in future server architecturesBenner, A.F. et al. | 2005
- 777
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Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirementsLanzerotti, M. Y. / Fiorenza, G. / Rand, R. A. et al. | 2005
- 777
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Packaging - Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirementsLanzerotti, M.Y. et al. | 2005
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POWER5 and Packaging| 2005