A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards (English)
- New search for: Weinberg, K.
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- New search for: Weinberg, K.
- New search for: Müller, W.H.
In:
Microelectronics Reliability
;
48
, 1
;
68-82
;
2008
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ISSN:
- Article (Journal) / Print
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Title:A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards
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Additional title:Eine Strategie für die Schadensbewertung bei thermisch verspannten Kupfer-Durchführungen in gedruckten Mikroelektronikschaltungen
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Contributors:Weinberg, K. ( author ) / Müller, W.H. ( author )
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Published in:Microelectronics Reliability ; 48, 1 ; 68-82
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Publisher:
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Publication date:2008
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Size:15 Seiten, 18 Bilder, 7 Tabellen, 25 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 48, Issue 1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
-
A study of nanoparticles in Sn–Ag based lead free soldersAmagai, Masazumi et al. | 2007
- 17
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A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drainBaishya, Srimanta / Mallik, Abhijit / Sarkar, Chandan Kumar et al. | 2006
- 23
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A 2D threshold-voltage model for small MOSFET with quantum-mechanical effectsXu, J.P. / Li, Y.P. / Lai, P.T. / Chen, W.B. / Xu, S.G. / Guan, J.G. et al. | 2006
- 29
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Modeling the sensitivity of CMOS circuits to radiation induced single event transientsWirth, Gilson I. / Vieira, Michele G. / Neto, Egas H. / Kastensmidt, Fernanda Lima et al. | 2006
- 37
-
Methodology of semiconductor devices classification into groups of differentiated qualityKonczakowska, Alicja et al. | 2006
- 45
-
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effectsHeller, E.R. / Crespo, A. et al. | 2007
- 51
-
A new electrothermal average model of the diode–transistor switchGórecki, Krzysztof et al. | 2007
- 59
-
Simultaneous mechanical and electrical straining of conventional thick-film resistorsStanimirović, Z. / Jevtić, M.M. / Stanimirović, I. et al. | 2006
- 68
-
A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boardsWeinberg, K. / Müller, W.H. et al. | 2007
- 83
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Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cyclingNakadaira, Yoshikuni / Jeong, Seyoung / Shim, Jongbo / Seo, Jaiseok / Min, Sunhee / Cho, Taeje / Kang, Sayoon / Oh, Seyong et al. | 2006
- 105
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Whisker growth on tin finishes of different electrolytesJiang, Bo / Xian, Ai-Ping et al. | 2007
- 111
-
Investigation of relation between intermetallic and tin whisker growths under ambient conditionKim, K.S. / Yu, C.H. / Han, S.W. / Yang, K.C. / Kim, J.H. et al. | 2007
- 119
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Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder jointMao, Chao-Yang / Chen, Rong-Sheng et al. | 2006
- 132
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Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditionsWang, Tong Hong / Lai, Yi-Shao / Lin, Yu-Cheng et al. | 2007
- 140
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Experimental and statistical study in adhesion features of bonded interfaces of IC packagesChien, Chi-Hui / Chen, Thaiping / Lin, Wei-Bang / Hsieh, Chi-Chang / Wu, Yii-Der / Yeh, Cheng-Hsiu et al. | 2006
- 149
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Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature riseDing, Yong / Kim, Jang-Kyo et al. | 2007
- 158
-
Clock aligner based on delay locked loop with double edge synchronizationStojčev, Mile / Jovanović, Goran et al. | 2007
- 167
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Book ReviewStojcev, Mile et al. | 2008