Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectric (English)
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In:
Microelectronics Reliability
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48
, 4
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526-530
;
2008
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ISSN:
- Article (Journal) / Print
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Title:Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectric
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Additional title:Einflüsse von Ti-Gehalt und Naß-Stickstoffglühen auf Ge-MOS-Kondensatoren mit HfTiO-Gate-Dielektrikum
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Contributors:Li, C.X. ( author ) / Zou, X. ( author ) / Lai, P.T. ( author ) / Xu, J.P. ( author ) / Chan, C.L. ( author )
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Published in:Microelectronics Reliability ; 48, 4 ; 526-530
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Publisher:
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Publication date:2008
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Size:5 Seiten, 5 Bilder, 2 Tabellen, 12 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 48, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 497
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A study of the linearity between Ion and logIoff of modern MOS transistors and its application to stress engineeringLau, W.S. / Yang, Peizhen / Eng, C.W. / Ho, V. / Loh, C.H. / Siah, S.Y. / Vigar, D. / Chan, L. et al. | 2007
- 504
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A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFETDai, M.Z. / Kim, S.I. / Yap, Andrew / Liu, Shaohua / Cheng, Arthur / Yi, Leeward et al. | 2007
- 508
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Investigation of hot carrier degradation in asymmetric nDeMOS transistorsWang, Qingxue / Sun, Lanxia / Yap, Andrew et al. | 2007
- 514
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Effects of the metal gate on the stress-induced traps in Ta2O5/SiO2 stacksAtanassova, E. / Paskaleva, A. / Novkovski, N. et al. | 2007
- 526
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Effects of Ti content and wet-N2 anneal on Ge MOS capacitors with HfTiO gate dielectricLi, C.X. / Zou, X. / Lai, P.T. / Xu, J.P. / Chan, C.L. et al. | 2007
- 531
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Degradation of n-channel a-Si:H/nc-Si:H bilayer thin-film transistors under DC electrical stressArpatzanis, N. / Hatzopoulos, A.T. / Tassis, D.H. / Dimitriadis, C.A. / Templier, F. / Oudwan, M. / Kamarinos, G. et al. | 2007
- 537
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Numerical and experimental analysis of EMI effects on circuits with MESFET devicesTsai, Han-Chang et al. | 2007
- 547
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Effect of doping concentration on avalanche multiplication and excess noise factor in submicron APDYou, A.H. / Cheang, P.L. et al. | 2007
- 555
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Leaky modes of optical waveguides with varied refractive index for microchip optical interconnect applications – Asymptotic solutionsZhu, Jianxin / Chen, Zhihua / Tang, Shuyuan et al. | 2007
- 563
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Thermal impedance measurements under non-equilibrium conditions. How to extend its validityMasana, F.N. et al. | 2007
- 569
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Effects of length scaling on electromigration in dual-damascene copper interconnectsLin, M.H. / Lin, M.T. / Wang, Tahui et al. | 2007
- 578
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Temperature-dependent stress-induced voiding in dual-damascene Cu interconnectsWu, ZhenYu / Yang, YinTang / Chai, ChangChun / Li, YueJin / Wang, JiaYou / Liu, Jing / Liu, Bin et al. | 2007
- 584
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Deposition of aerosol (“hygroscopic dust”) on electronics – Mechanism and riskTencer, Michal et al. | 2007
- 594
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Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strengthHe, Jun / Guo, Yongjin / Lin, Zhongqin et al. | 2007
- 602
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Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)Zhang, Xiaowu / Kripesh, Vaidyanathan / Chai, T.C. / Tan, Teck Chun / Pinjala, D. et al. | 2007
- 611
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The influence of solder volume and pad area on Sn–3.8Ag–0.7Cu and Ni UBM reaction in reflow soldering and isothermal agingWong, C.K. / Pang, J.H.L. / Tew, J.W. / Lok, B.K. / Lu, H.J. / Ng, F.L. / Sun, Y.F. et al. | 2007
- 622
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Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assembliesNousiainen, O. / Lehtiniemi, L. / Kangasvieri, T. / Rautioaho, R. / Vähäkangas, J. et al. | 2007
- 631
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Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatingsLee, Young Woo / Lee, Ki Ju / Zhou, Y. Norman / Jung, Jae Pil et al. | 2007
- 638
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Combining vibration test with finite element analysis for the fatigue life estimation of PBGA componentsChen, Y.S. / Wang, C.S. / Yang, Y.J. et al. | 2007
- 645
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Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFsHwang, J.S. et al. | 2007
- 652
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Effect of surface finish material on printed circuit board for electrochemical migrationNoh, Bo-In / Lee, Jong-Bum / Jung, Seung-Boo et al. | 2007
- 657
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Book ReviewStojcev, M. et al. | 2008