Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods (English)
- New search for: Zimmermann, Sven
- New search for: Ahner, Nicole
- New search for: Blaschta, Frieder
- New search for: Schaller, Matthias
- New search for: Zimmermann, Henrik
- New search for: Rülke, Hartmut
- New search for: Lang, Norbert
- New search for: Röpcke, Jürgen
- New search for: Schulz, Stefan E.
- New search for: Gessner, Thomas
- New search for: Zimmermann, Sven
- New search for: Ahner, Nicole
- New search for: Blaschta, Frieder
- New search for: Schaller, Matthias
- New search for: Zimmermann, Henrik
- New search for: Rülke, Hartmut
- New search for: Lang, Norbert
- New search for: Röpcke, Jürgen
- New search for: Schulz, Stefan E.
- New search for: Gessner, Thomas
In:
AMC, Advanced Metallization Conference, 26
;
101-110
;
2010
-
ISBN:
- Conference paper / Print
-
Title:Improvement of etch processes for SiCOH materials with novel in situ diagnostic and evaluation methods
-
Contributors:Zimmermann, Sven ( author ) / Ahner, Nicole ( author ) / Blaschta, Frieder ( author ) / Schaller, Matthias ( author ) / Zimmermann, Henrik ( author ) / Rülke, Hartmut ( author ) / Lang, Norbert ( author ) / Röpcke, Jürgen ( author ) / Schulz, Stefan E. ( author ) / Gessner, Thomas ( author )
-
Published in:
-
Publisher:
- New search for: Materials Research Society (MRS)
-
Place of publication:Warrendale
-
Publication date:2010
-
Size:10 Seiten, 11 Bilder, 14 Quellen
-
ISBN:
-
Type of media:Conference paper
-
Type of material:Print
-
Language:English
-
Keywords:experimentelle Untersuchung , Tagungsbericht , Argon , Sauerstoff , Fluorkohlenstoff , Plasmaätzen , Rasterelektronenmikroskopie , Kontaktwinkelmessung , Ellipsometrie , Fourier-Transform-Infrarotspektroskopie , Dissoziationsvorgang , Reaktionsprodukt , Additiv , Emissionsspektrometrie , Oberflächenenergie , Dielektrizitätskonstante , Korrelationskoeffizient , Konzentrationseinfluss , Sättigung , Massenspektrometrie , Absorptionsspektrometrie , dielektrischer Stoff , In-Situ-Messung
-
Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
-
A Study on Resistivity Increase of Copper Interconnects With the Comparable to Electron Mean Free Path Utilizing Monte Carlo SimulationsWada, M. / Kurusu, T. / Akimoto, Y. / Matsunaga, N. / Tanimoto, H. / Aoki, N. / Toyoshima, Y. / Shibata, H. / University of California, Berkeley et al. | 2010
- 11
-
Quantitative Analysis of the Impact of Surface and Grain Boundary Scattering on the Resistivity of Nanometric Cu FilmsSun, T. / Yao, B. / Warren, A.P. / Barmak, K. / Toney, M. / Peale, R. / Coffey, K.R. / University of California, Berkeley et al. | 2010
- 19
-
Origins of Large Variation in Ductility of Thin Metal Films on Polymer SubstratesLi, T. / Michaux, B. / Zhang, Z. / University of California, Berkeley et al. | 2010
- 27
-
Nucleation Effects of Tungsten Chemical Vapor Deposition on B2H6 Pre-Treated Titanium Nitride for sub-45 nm ContactsRozenblat, A.A. / Drori, R. / Rotlain, M. / Shacham-Diamand, Y. / Horvitz, D. / University of California, Berkeley et al. | 2010
- 35
-
Evaluation of Selective Metal Deposition (Selectroplating®)Mavliev, R. / Gambino, J. / University of California, Berkeley et al. | 2010
- 45
-
Silicon Precursor Development for Advanced Barrier IntegrationMatz, L. / Mallikarjunan, A. / Vrtis, R.N. / Johnson, A.D. / Jiang, X. / O Neill, M. / University of California, Berkeley et al. | 2010
- 55
-
Restoration of Plasma Damaged Porous Ultra Low-k SiOCH Films: A Coating Process With UV Activation Versus a Vapor Phase Process With Thermal ActivationOszinda, T. / Schaller, M. / Leppack, S. / Schulz, S.E. / University of California, Berkeley et al. | 2010
- 65
-
Fabrication of Porogen Residue Free Ultra Low-k PECVD Material by Subsequent H~2-Afterglow Plasma Treatment and UV CuringUrbanowicz, A.M. / Vanstreels, K. / Verdonck, P. / Shamiryan, D. / Cremel, M. / De Gendt, S. / Baklanov, M.R. / University of California, Berkeley et al. | 2010
- 75
-
Metal Hard-Mask Based Double Patterning for 22 nm and BeyondStruyf, H. / de Marneffe, J.-F. / Goossens, D. / Hendrickx, D. / Huffman, C. / Kunnen, E. / Lazzarino, F. / Milenin, A. / Shamiryan, D. / Urbanowicz, A.M. et al. | 2010
- 83
-
Investigation of Cu Bimetallic Corrosion in CMP Chemical Environments Using Micropattern Corrosion ScreeningPillai, K.S. / Nalla, P.R. / Yu, K.K. / Venkataraman, S. / Oliver, C. / University of California, Berkeley et al. | 2010
- 93
-
Modeling and Applications of Copper Interconnect Chemical Mechanical Polishing (CMP) SimulationArthanari, S. / Yu, S. / Liao, M. / Inani, A. / Shimazu, K. / Stine, B. / University of California, Berkeley et al. | 2010
- 101
-
Improvement of Etch Processes for SiCOH Materials With Novel In Situ Diagnostic and Evaluation MethodsZimmermann, S. / Ahner, N. / Blaschta, F. / Schaller, M. / Zimmermann, H. / Rulke, H. / Lang, N. / Ropcke, J. / Schulz, S.E. / Gessner, T. et al. | 2010
- 111
-
The Effect of Plating and Anneal Conditions on Post CMP DefectsMarshall, M. / Shaviv, R. / Mountsier, T. / Reid, J. / McKerrow, A. / University of California, Berkeley et al. | 2010
- 117
-
Aluminum Pad Cleaning With Diluted Organic Acids for CMOS Image SensorsBilouk, S. / Broussous, L. / Nogueira, R.P. / Jayet, C. / Pernel, C. / University of California, Berkeley et al. | 2010
- 127
-
Electronic Transport Properties of Copper Atomic WiresMohammadzadeh, S. / Streiter, R. / Gessner, T. / University of California, Berkeley et al. | 2010
- 133
-
Low Temperature Silicidation of Pd Layers on Crystalline Silicon Monitored Via In Situ Resistance MeasurementsFaber, E.J. / Wolters, R.A. / Rajasekharan, B. / Salm, C. / Schmitz, J. / University of California, Berkeley et al. | 2010
- 141
-
Determinant of Electrical Leakage Current for Porous SiOC FilmMatsushita, K. / Nakano, A. / Yanagisawa, I. / Nonaka, Y. / Kobayashi, N. / University of California, Berkeley et al. | 2010
- 147
-
Evolution of Cu/SiO~2 and Cu/Ta Interface Roughness With AnnealingWarren, A.P. / Sun, T. / Yao, B. / Barmak, K. / Toney, M. / Coffey, K.R. / University of California, Berkeley et al. | 2010
- 157
-
Key Aspects of CoWP and ULK Implementation Into High-Volume Manufacturing for Future TechnologiesNopper, M. / Bommels, J. / Aubel, O. / Hartz, H. / Preusse, A. / University of California, Berkeley et al. | 2010
- 167
-
Advanced Metallization Developments for 32 nm Node CMOS Technology Contact ArchitectureDoug, L. / Arunachalam, V. / Amarnath, K. / Papadatos, F. / Zhang, H. / Li, Z. / Wong, K. / Lee, W.-H. / Liang, S. / Chudzik, M. et al. | 2010
- 173
-
Integration of an Organic Ultra Low-k (k=2.2) MaterialPantouvaki, M. / Zhao, L. / Huffman, C. / Heylen, N. / Ferchichi, A. / Ono, Y. / Nakajima, M. / Nakatani, K. / Struyf, H. / Beyer, G. et al. | 2010
- 179
-
CoWP metal caps for reliable 32 nm in Cu interconnects in porous ULK (k=2.4)Huang, E. / Oh, M. / Law, S.B. / Petitdidier, S. / Ko, T.M. / Sawada, H. / Tang, T.J. / Hu, C.K. / Cohen, S. / Liniger, E. et al. | 2010
- 179
-
CoWP Metal Caps for Reliable 32 nm 1X Cu Interconnects in Porous ULK (k=2.4)Huang, E. / Oh, M. / Law, S.B. / Petitdidier, S. / Ko, T.-M. / Sawada, H. / Tang, T.J. / Hu, C.-K. / Bonilla, G. / Rath, D. et al. | 2010
- 185
-
UV Curing-Induced Photoresist Poisoning in Advanced ULK BEOL Integration SchemesEe, Y.C. / Kioussis, D. / Angyal, M.S. / Kapur, A. / Yi, F. / Engel, B.H. / Passano, A.O. / Klymko, N.R. / Madan, A. / Wang, J. et al. | 2010
- 193
-
Electroless CoWP Integration Scheme to Enhance Cu Interconnect Reliability at Ultra Narrow LineMoon, K.-J. / Yun, J.-H. / Choi, Z.-S. / Jung, H.-K. / Lee, J.-M. / Choi, G.-H. / Choi, S. / Moon, J.-T. / University of California, Berkeley et al. | 2010
- 201
-
Electromigration Improvement for 40 nm and Below Through Diffusion Barrier Interface Engineering Using New PrecursorLe-Friec, Y. / Ye, W. / Zubkov, V. / Conti, G. / Shek, M.Y. / Xia, L.-Q. / Witty, D.R. / Chhun, S. / Arnaud, L. / Petitprez, E. et al. | 2010
- 201
-
Electromigration improvement for 40nm and below through diffusion barrier interface engineering using a new precursorLe-Friec, Y. / Ye, W. / Zubkov, V. / Conti, G. / Shek, M.y. / Xia, L.Q. / Witt, D.R. / Chhun, S. / Arnaud, L. / Petiprez, E. et al. | 2010
- 207
-
Adhesion, Copper Voiding, and Debonding Kinetics of Copper/Dielectric Diffusion Barrier FilmsBirringer, R. / Shaviv, R. / Mountsier, T. / Reid, J. / Zhou, J. / Geiss, R. / Read, D. / Dauskardt, R. / University of California, Berkeley et al. | 2010
- 213
-
Electrical and Microstructural Investigation of the Reliability of Power Devices After Electro-Thermal FatigueMartineau, D. / Mazeaud, T. / Legros, M. / Dupuy, P. / Sauveplane, J.-B. / Tounsi, P. / Levade, C. / Vanderschaeve, G. / University of California, Berkeley et al. | 2010
- 223
-
Impact of Impedance Mismatch of On-Die Interconnects and Logic Cells on Device Reliability and FunctionalityLivshits, P. / Gurfinkel, M. / Rysin, A. / Sofer, S. / Shapira, Y. / Fefer, Y. / University of California, Berkeley et al. | 2010
- 231
-
CMOS Compatible Insulated Through Silicon Vias for 3D SiliconStamper, A.K. / Shapiro, M. / Herrin, R. / Carlos, V. / White, E. / Brigham, M. / Porth, B. / Levy, J. / Dang, D. / Gupta, A. et al. | 2010
- 241
-
Electrochemical Deposition of Reactive Nanoscale Metallization Systems for Low Temperature Bonding in 3D IntegrationHofmann, L. / Braeuer, J. / Baum, M. / Schulz, S.E. / Gessner, T. / University of California, Berkeley et al. | 2010
- 253
-
Seed Layer Enhancement: An Efficient Process for the Fabrication of 3D InterconnectsCuzzocrea, J. / Deronzier, E. / Haumesser, P.-H. / Assous, M. / De Labretoigne, J.-B. / Baskaran, R. / Chainet, E. / University of California, Berkeley et al. | 2010
- 259
-
Application of Self Assembly Monolayer (SAM) in Cu-Cu Bonding Enhancement at Low Temperature for 3D IntegrationLim, D.F. / Singh, S.G. / Ang, X.F. / Wei, J. / Ng, C.M. / Tan, C.S. / University of California, Berkeley et al. | 2010
- 269
-
Metallic Conduction in ZnO/Cu/ZnO Thin FilmsSivaramakrishnan, K. / David, T. / Moulder, J. / Alford, T.L. / University of California, Berkeley et al. | 2010
- 281
-
Effect of Thermal Processing on Silver Contacts for Zinc Oxide and Indium Tin OxideSivaramakrishnan, K. / Alford, T.L. / Iyer, S. / David, T. / University of California, Berkeley et al. | 2010