Diamond layout style impact on SOI MOSFET in high temperature environment (English)
- New search for: Gimenez, Salvador Pinillos
- New search for: Galembeck, Egon Henrique Salerno
- New search for: Renaux, Christian
- New search for: Flandre, Denis
- New search for: Gimenez, Salvador Pinillos
- New search for: Galembeck, Egon Henrique Salerno
- New search for: Renaux, Christian
- New search for: Flandre, Denis
In:
Microelectronics Reliability
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55
, 5
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783-788
;
2015
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ISSN:
- Article (Journal) / Print
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Title:Diamond layout style impact on SOI MOSFET in high temperature environment
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Contributors:Gimenez, Salvador Pinillos ( author ) / Galembeck, Egon Henrique Salerno ( author ) / Renaux, Christian ( author ) / Flandre, Denis ( author )
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Published in:Microelectronics Reliability ; 55, 5 ; 783-788
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Publisher:
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Publication date:2015
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Size:6 Seiten, 17 Quellen
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ISSN:
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Coden:
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DOI:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Keywords:
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Source:
Table of contents – Volume 55, Issue 5
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 713
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Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-SystemsWymysłowski, Artur et al. | 2015
- 716
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Assessment of long term reliability of photovoltaic glass–glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysisKraemer, F. / Wiese, S. et al. | 2015
- 722
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The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modulesEdwards, Michael / Brinkfeldt, Klas / Rusche, Ulrich / Bukes, Tobias / Gaiser, Gerd / Da Silva, Melina / Andersson, Dag et al. | 2015
- 733
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Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability predictionWatzke, S. / Altieri-Weimar, P. et al. | 2015
- 738
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Thermo-mechanical characterization of passive stress sensors in Si interposerVianne, Benjamin / Bar, Pierre / Fiori, Vincent / Gallois-Garreignot, Sébastien / Ewuame, Komi Atchou / Chausse, Pascal / Escoubas, Stéphanie / Hotellier, Nicolas / Thomas, Olivier et al. | 2015
- 747
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Computationally efficient and stable order reduction methods for a large-scale model of MEMS piezoelectric energy harvesterKudryavtsev, M. / Rudnyi, E.B. / Korvink, J.G. / Hohlfeld, D. / Bechtold, T. et al. | 2015
- 758
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Adhesion work analysis through molecular modeling and wetting angle measurementKról, Dawid Jan / Wymysłowski, Artur / Allaf, Kamil Nouri et al. | 2015
- 765
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Microstructure simulation of grain growth in Cu through silicon vias using phase-field modelingNabiollahi, Nabi / Moelans, Nele / Gonzalez, Mario / De Messemaeker, Joke / Wilson, Christopher J. / Croes, Kristof / Beyne, Eric / De Wolf, Ingrid et al. | 2015
- 771
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Multiphysics modeling approach for micro electro–thermo–mechanical actuator: Failure mechanisms coupled analysisWang, Jinling / Zeng, Shengkui / Silberschmidt, Vadim V. / Guo, Jianbin et al. | 2015
- 783
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Diamond layout style impact on SOI MOSFET in high temperature environmentGimenez, Salvador Pinillos / Galembeck, Egon Henrique Salerno / Renaux, Christian / Flandre, Denis et al. | 2015
- 789
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Potentiality of trap charge effects and SiON induced interface defects in a-Si3N4/SiON based MIS structure for resistive NVM deviceDinara, Syed Mukulika / Ghosh, Saptarsi / Halder, Nripendra N. / Bag, Ankush / Bhattacharya, Sekhar / Biswas, D. et al. | 2015
- 795
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Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristicsMoon, Pyung / Lim, Jun Yeong / Youn, Tae-Un / Noh, Keum-Whan / Yun, Ilgu et al. | 2015
- 799
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Failure analysis on reflector blackening between lead frame electrodes in LEDs under WHTOL testZhang, Lei / Zhu, Yejun / Chen, Haibin / Leung, Karina / Wu, Yeqing / Wu, Jingshen et al. | 2015
- 807
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Low-power MicroVrms noise neural spike detector for implantable interface microsystem deviceLi, Hongge / Bai, Huixin / Xu, Qicheng / Xia, Tongsheng et al. | 2015
- 815
-
Life test of an X-band MMIC multi-function chip for active phased array radar applicationsJeong, Jin-Cheol / Kwak, Changsoo / Yom, In-Bok / Seo, In-Jong / Jo, In-Ho et al. | 2015
- 822
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Thermal resistance of side by side multi-chip package: Thermal mode analysisChen, Dao-Long / Chen, Tei-Chen / Yang, Ping-Feng / Lai, Yi-Shao et al. | 2015
- 832
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Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growthDoudrick, Kyle / Chinn, Jeff / Williams, Jason / Chawla, Nikhilesh / Rykaczewski, Konrad et al. | 2015
- 838
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Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronicsEun, Kyoungtae / Chon, Min-Woo / Yoo, Tae-Hee / Song, Yong-Won / Choa, Sung-Hoon et al. | 2014
- 846
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Mechanical stress field assisted charge de-trapping in carbon doped oxidesAlam, M.T. / Maletto, K.E. / Bielefeld, J. / King, S.W. / Haque, M.A. et al. | 2015
- IFC
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Inside front cover - Editorial board| 2015