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Acoustic emission for detecting deterioration of capacitors under aging
Tema Archive | 2011|Keywords: Zuverlässigkeit von Bauelementen -
Testing semiconductor devices at extremely high operating temperatures
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Effects of length scaling on electromigration in dual-damascene copper interconnects
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Self-heating and loss of thermal stability under a single current surge pulse in high-voltage 4H-SiC rectifier diodes
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Drain current model for undoped gate stack double gate (GSDG) MOSFETs including the hot-carrier degradation effects
Tema Archive | 2011|Keywords: Zuverlässigkeit von Bauelementen -
The critical role of processing and morphology in determining degradation rates in polymer solar cells
Tema Archive | 2011|Keywords: Zuverlässigkeit von Bauelementen -
Reliability analysis of temperature step-stress tests on III-V high concentrator solar cells
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
Sensitivity analysis of simplified printed circuit board finite element models
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
Thermal transient characteristics of die attach in high power LED PKG
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Energy thermo generation in aeronautics for battery-free wireless sensor networks
Tema Archive | 2013|Keywords: Zuverlässigkeit von Bauelementen -
Ultrasmall implantable composite microelectrodes with bioactive surfaces for chronic neural interfaces
Tema Archive | 2012|Keywords: Zuverlässigkeit von Bauelementen -
Theoretical and numerical analysis of the effect of constant velocity on thermosonic bond strength
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Stability of thin film resistors - Prediction and differences base on time-dependent Arrhenius law
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
Laboratory performance tests on aluminum splices for power conductors
Tema Archive | 2010|Keywords: Zuverlässigkeit von Bauelementen -
Reliability evaluation of BOAC and normal pad stacked-chip packaging using low-K wafers
Tema Archive | 2008|Keywords: Zuverlässigkeit von Bauelementen -
Vibration reliability test and finite element analysis for flip chip solder joints
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
SiGe HBTs for application in BiCMOS technology: I. stability, reliability and material parameters
Tema Archive | 2001|Keywords: Zuverlässigkeit von Bauelementen -
A CMOS circuit for evaluating the NBTI over a wide frequency range
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
Physical phenomena affecting performance and reliability of 4H-SiC bipolar junction transistors
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen -
Thermal imaging of smart power DMOS transistors in the thermally unstable regime using a compact transient interferometric mapping system
Tema Archive | 2009|Keywords: Zuverlässigkeit von Bauelementen
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