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CONDUCTOR RAIL, AND POWER SEMICONDUCTOR MODULE ARRANGEMENT COMPRISING A CONDUCTOR RAIL
Free accessEuropean Patent Office | 2024| -
Chipanordnungen und Verfahren zum Bilden einer Chipanordnung
Free accessEuropean Patent Office | 2024| -
SUBSTRATE ARRANGEMENT AND METHODS FOR PRODUCING A SUBSTRATE ARRANGEMENT
Free accessEuropean Patent Office | 2024| -
Semiconductor package having a chip carrier with a pad offset feature
Free accessEuropean Patent Office | 2024| -
Fusion of ultrasonic touch sensor and capacitive pressure sensing micro-electro-mechanical system
Free accessEuropean Patent Office | 2024| -
VEHICLE, DEVICE, COMPUTER PROGRAM AND METHOD FOR LOADING DATA
Free accessEuropean Patent Office | 2024| -
MAGNETORESISTIVE MAGNETIC FIELD SENSOR HAVING A FREELY SELECTABLE MAGNETIC OPERATING POINT
Free accessEuropean Patent Office | 2024| -
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
Free accessEuropean Patent Office | 2024| -
VORRICHTUNGEN, SYSTEME UND VERFAHREN ZUR IMPLEMENTIERUNG EINER ECHTZEITUHR
Free accessEuropean Patent Office | 2024| -
Molded power semiconductor module and manufacturing method thereof
Free accessEuropean Patent Office | 2024| -
DATA LINK LAYER AUTHENTICITY AND SECURITY FOR AUTOMOTIVE COMMUNICATION SYSTEM
Free accessEuropean Patent Office | 2024| -
Linearer tunnel-magnetoresistiver Sensor mit einem integrierten Back-Bias-Magneten
Free accessEuropean Patent Office | 2024| -
SEMICONDUCTOR DIE HAVING AN OPTICAL DETECTION MARKER AND METHOD OF PRODUCING THE SEMICONDUCTOR DIE
Free accessEuropean Patent Office | 2024| -
LEISTUNGSELEKTRONIKVORRICHTUNG UND VERFAHREN ZU IHRER HERSTELLUNG
Free accessEuropean Patent Office | 2024| -
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
Free accessEuropean Patent Office | 2024|
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