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Flip chip assembly of thinned chips for hybrid pixel detector applications
Free accessFraunhofer Publica | 2014| -
3D TSV hybrid pixel detector modules with ATLAS FE-I4 readout electronic chip
IOP Institute of Physics | 2022| -
Design and test of pixel sensors for operation in severe radiation environments
Tema Archive | 2000| -
Concept, realization and characterization of serially powered pixel modules (Serial Powering)
Free accessArXiv | 2006| -
Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
British Library Online Contents | 2012| -
Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
Free accessArXiv | 2011| -
Functional characterization of irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
Free accessArXiv | 2011| -
Characterization of proton irradiated 3D-DDTC pixel sensor prototypes fabricated at FBK
Online Contents | 2012|Contributors: Huegging, F. -
3D silicon pixel sensors: Recent test beam results
Online Contents | 2011|Contributors: Huegging, F. -
Alignment of the Pixel and SCT Modules for the 2004 ATLAS Combined Test Beam
Free accessArXiv | 2008| -
Design of analog front-ends for the RD53 demonstrator chip
Free accessBASE | 2016|Contributors: Huegging, F. -
Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC
Free accessBASE | 2016|Contributors: Huegging, F. -
A Layer Correlation technique for pion energy calibration at the 2004 ATLAS Combined Beam Test
Free accessArXiv | 2010|
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