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Future interconnect technologies and copper metallization - As the interconnect system becomes a dominant factor in determining device performance and cost, the IC industry is undergoing fundamental changes in both design methodology and process technology. Future on-chip interconnects will not be able to rely on standard Al-SiO2 designs. Copper metal is only one part of the solution that includes a revolution in design tools.
Online Contents | 1998| -
Morphology of Al-Ni Ge ohmic contacts to n-GaAs as a function of contact composition
Online Contents | 1994| -
Structural characterization of encapsulated Au-Zn-Au ohmic contacts to p-type GaAs
Online Contents | 1993| -
Ge-Si heterostructures grown by Sn-surfactant-mediated molecular beam epitaxy
Online Contents | 1995| -
A Numerical Study of Oscillatory Flow about a Circular Cylinder for Low Values of Beta Parameter
Online Contents | 1996| -
Morphological transition of InAs islands on GaAs(001) upon deposition of a GaAs capping layer
Online Contents | 1994| -
Low-temperature ion-induced epitaxial growth of a-FeSi2 and cubic FeSi2 in Si
Online Contents | 1993| -
Study on Technology Development of Power System Training Simulator for Modern Ship
British Library Conference Proceedings | 2012|
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