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Synonyms were used for: Festigkeit
Search without synonyms: keywords:("Festigkeit")
Used synonyms:
- festigkeitsverhalten
- strength of materials
-
Microstructure Characterization of Lead-Free Solders Depending on Alloy Composition
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
fibDAC Stress Relief-A Novel Stress Measurement Approach for BEoL Structures
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Growth of Single Crystalline Copper Nanowhiskers
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Electron Backscattered Diffraction Analysis of Narrow Copper Interconnects in Cross-View to Investigate Scale Effect on Microstructure
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Maschinenelemente / Berthold Schlecht ; 1: Festigkeit, Wellen, Verbindungen, Federn, Kupplungen
TIBKAT | 2015|Keywords: Festigkeit -
Elimination of the Axial Deformation Problem of Cu-TSV in 3D Integration
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Thermomechanical Reliability Challenges for 3D Interconnects with Through-Silicon Vias
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Quality Control on Strained Semiconductor Devices
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Influence of the Activation Energy of the Different Migration Effects on Failure Locations in Metallization
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Micro-Scale Evaluation of Interface Strength on the Patterned Structures in LSI Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Thermomechanical Reliability Challenges for 3D Interconnects with Through-Silicon Vias
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Conical Dark-Field Analysis for Small Grain Characterization in Narrow Cu Interconnect Structures: Potential and Challenges
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Effect of Impurity on Cu Electromigration
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Optimization of Dielectric and Elastic Properties of Nanoporous Ultralow-K Dielectric Materials
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Design and Application of a Sensor to Monitor Stress in Deep Submicron Copper Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
fibDAC Stress Relief-A Novel Stress Measurement Approach for BEoL Structures
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Stress Phenomena in Times of Porous Low-K Dielectrics
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Grain Size and Cap Layer Effects on Electromigration Reliability of Cu Interconnects: Experiments and Simulation
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Investigation of Stress-Induced Voiding of Double Cross-Shaped Single via Test Structure and Derivatives for Deep-Sub Micron Technology Nodes
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Improved Interconnect Properties for Nano-Twinned Copper: Microstructure and Stability
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Damage Induced in Interconnect Structures Mimicking Stresses during Flip Chip Packaging
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Assessment of Mechanical Properties of Nanoscale Structures for Microprocessor Manufacturing
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Advanced Stress, Strain and Geometrical Analysis in Semiconductor Devices
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Application of Ti-Based Self-Formation Barrier Layers to Cu Dual-Damascene Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Impact of Surface and Grain Boundary Scattering on the Resistivity of Nanometric Cu Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Time and Temperature Dependent Micromechanical Properties of Solder Joints for 3D-Package Integration
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Mechanical Solder Characterisation under High Strain Rate Conditions
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
A New Methodology for In-Situ Residual Stress Measurement in MEMS Structures
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Electron Backscattered Diffraction Analysis of Narrow Copper Interconnects in Cross-View to Investigate Scale Effect on Microstructure
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Damage Induced in Interconnect Structures Mimicking Stresses during Flip Chip Packaging
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Time and Temperature Dependent Micromechanical Properties of Solder Joints for 3D-Package Integration
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Assessment of Mechanical Properties of Nanoscale Structures for Microprocessor Manufacturing
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Quality Control on Strained Semiconductor Devices
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Microstructure Characterization of Lead-Free Solders Depending on Alloy Composition
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Strain Determination Using Electron Backscatter Diffraction
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Growth of Single Crystalline Copper Nanowhiskers
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Investigation of Stress-Induced Voiding of Double Cross-Shaped Single via Test Structure and Derivatives for Deep-Sub Micron Technology Nodes
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Effect of Microstructure on Electromigration in Pb-Free Solder Interconnect
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Sub-Imaging Techniques for 3D-Interconnects on Bonded Wafer Pairs
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
3D IC TSV-Based Technology: Stress Assessment for Chip Performance
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Strain Determination Using Electron Backscatter Diffraction
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
A New Methodology for In-Situ Residual Stress Measurement in MEMS Structures
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Stress Phenomena in Times of Porous Low-K Dielectrics
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Effect of Impurity on Cu Electromigration
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Micro-Scale Evaluation of Interface Strength on the Patterned Structures in LSI Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Optimization of Dielectric and Elastic Properties of Nanoporous Ultralow-K Dielectric Materials
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Design and Application of a Sensor to Monitor Stress in Deep Submicron Copper Interconnects
British Library Conference Proceedings | 2010|Keywords: Strength of materials -
Conical Dark-Field Analysis for Small Grain Characterization in Narrow Cu Interconnect Structures: Potential and Challenges
British Library Conference Proceedings | 2010|Keywords: Strength of materials
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