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TIB reading rooms collection
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2023 International Conference on Electronics Packaging (ICEP) : April 19(Wed.) - 22(Sat.)
TIBKAT | 2023|Keywords: International Microelectronics and Packaging Society Japan Chapter, Components, Packaging, and Manufacturing Technology Society Japan Chapter -
Education and Later-life Mortality : Evidence from a School Reform in Japan
TIBKAT | 2023|Keywords: Japan -
2022 International Conference on Electronics Packaging (ICEP 2022) : May 11 (Wed.)-14 (Sat.)
TIBKAT | 2022|Keywords: International Microelectronics and Packaging Society Japan Chapter, Components, Packaging, and Manufacturing Technology Society Japan Chapter -
2021 International Conference on Electronics Packaging (ICEP 2021) : dates: May 12 (Wed.)-14 (Fri.)
TIBKAT | 2021|Keywords: International Microelectronics and Packaging Society Japan Chapter, Components, Packaging, and Manufacturing Technology Society Japan Chapter -
Démographie, climat et alimentation mondiale
Free accessTIBKAT | 2021|Keywords: Fukushima Nuclear Disaster, Japan, 2011, Tohoku Earthquake and Tsunami, Japan, 2011 -
2020nen sōgō taikai kōen ronbunshū : denshi jōhō tsūshin to kagaku no kyōsō suru mirai : nichij: 2020nen 3gatsu 17nichi (ka)-20ka (kin), kaijō: Hiroshima Daikaku Higashihiroshima Kyanpasu (Higashihiroshima-shi).
2020年総合大会講演論文集 : 電子情報通信と科学の共創する未来 : 会期:2020年3月17日(火)~20日(金) 会場:広島大学 東広島キャンパス(東広島市)TIBKAT | 2020|Keywords: Japan -
L' accident majeur de Fukushima : Considérations sismiques, nucléaires et médicales
Free accessTIBKAT | 2020|Keywords: Fukushima Nuclear Disaster, Japan, 2011, Tohoku Earthquake and Tsunami, Japan, 2011 -
25th Symposium on “Microjoining and Assembly Technology in Electronics” : January 29-30 2019, Yokohama
TIBKAT | 2019|Keywords: Japan -
2019nen Eizō Jōhō Media Gakkai Tōki Taikai kōen yokōshū : 2019nen 12gatsu 12ka (moku), 13nichi (kin), Denki Tsūshin Daigaku
TIBKAT | 2019|Keywords: Japan -
2019nen sōgō taikai kōen ronbunshū : kongo 100nen ni muketa denshi jōhō tsūshin : nichij: 2018nen 3gatsu 19nichi (ka)-22nichi (kin), kaijō: Waseda Daigaku Nishinwaseda Kyanpasu (Tōkyō).
2019年総合大会講演論文集 : 今後100年に向けた電子情報通信 : 会期:2019年3月19日(火)~22日(金) 会場:早稲田大学 西早稲田キャンパス(東京)TIBKAT | 2019|Keywords: Japan
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