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Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?
Free accessSpringer Verlag | 2014| -
Ultrabroadband Microwave Metamaterial Absorber Based on Electric SRR Loaded with Lumped Resistors
Springer Verlag | 2016| -
Characterization of Copper Oxide Nanoparticles Fabricated by the Sol–Gel Method
Springer Verlag | 2015| -
Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability
Springer Verlag | 2014| -
Development of a System for Thermoelectric Heat Recovery from Stationary Industrial Processes
Springer Verlag | 2016| -
Dye-Sensitized Solar Cell for Indoor Applications: A Mini-Review
Free accessOnline Contents | 2021| -
Bonding of Bi2Te3-Based Thermoelectric Legs to Metallic Contacts Using Bi0.82Sb0.18 Alloy
Springer Verlag | 2015|
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