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SEPARATION METHOD FOR SUBSTRATE, MANUFACTURING METHOD FOR SEMICONDUCTOR STORAGE DEVICE, AND SUBSTRATE SEPARATION DEVICE
Free accessEuropean Patent Office | 2020| -
Method of separating bonded substrate, method of manufacturing semiconductor storage device, and substrate separation apparatus
Free accessEuropean Patent Office | 2021| -
METHOD OF SEPARATING BONDED SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE, AND SUBSTRATE SEPARATION APPARATUS
Free accessEuropean Patent Office | 2020| -
Manufacturing method of semiconductor device and template for nanoimprint
Free accessEuropean Patent Office | 2018| -
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEMPLATE FOR NANOIMPRINT
Free accessEuropean Patent Office | 2017| -
Substrate planarizing method and dropping amount calculating method
Free accessEuropean Patent Office | 2018| -
Mechanism of reducing line edge roughness in ArF photoresist by using CF3I plasma
Online Contents | 2009| -
SUBSTRATE FLATTENING METHOD AND METHOD FOR CALCULATING DROPPING AMOUNT
Free accessEuropean Patent Office | 2016| -
SUBSTRATE PLANARIZING METHOD AND DROPPING AMOUNT CALCULATING METHOD
Free accessEuropean Patent Office | 2016| -
Nonvolatile semiconductor memory device and method of manufacturing nonvolatile semiconductor memory device
Free accessEuropean Patent Office | 2016| -
Environmentally harmonized CF3I plasma for low-damage and highly selective low-k etching
National licenceAmerican Institute of Physics | 2008| -
Reduction effect of line edge roughness on time-dependent dielectric breakdown lifetime of Cu/low- interconnects by using etching
American Institute of Physics | 2009| -
Mechanism of reducing line edge roughness in ArF photoresist by using plasma
American Institute of Physics | 2009| -
An oxygen-releasing device: reversible oxygen release from a cobalt chelate–carbon composite in response to an applied voltage
National licenceRoyal Society of Chemistry | 1997|
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