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Process development and performance analysis of additively printed humidity sensor using aerosol jet printing
British Library Conference Proceedings | 2020| -
Process Recipes for SMD Interconnection on Aqueous Conductive Inks using Direct-Write Printing
British Library Conference Proceedings | 2023| -
Performance and Reliability of SMD Interconnections using Low-Temperature Solders and ECAs for FHE applications
British Library Conference Proceedings | 2023| -
Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications
British Library Conference Proceedings | 2022| -
Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
British Library Conference Proceedings | 2021| -
Process Recipes and Performance of Printable Formable Inks for In-Mold Electronics Applications
British Library Conference Proceedings | 2023| -
Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
British Library Conference Proceedings | 2021| -
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
British Library Conference Proceedings | 2021| -
Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits
British Library Conference Proceedings | 2022| -
Interaction of Photonic Curing Process Parameters on Additively Printed Copper Circuits
British Library Conference Proceedings | 2022| -
Comparison of Component Assembly Process-Reliability Relationships of Low-Temperature Solders and ECAs on Flexible Direct-Write Additive Circuits
British Library Conference Proceedings | 2022| -
Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
British Library Conference Proceedings | 2021|
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