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0.35 micrometer CMOS technology with chemical mechanical polishing for three metallization levels planarization
Tema Archive | 1994|Keywords: Multilayer-Technik (Schaltung) -
3-D capacitance modeling of advanced multilayer interconnection technologies
Tema Archive | 1991|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
3D interconnection technology for LTCC RF modules up to 60 GHz
Tema Archive | 2006|Keywords: Multilayer-Technik (Schaltung) -
4x4 polymer thermo-optic directional coupler switch at 1.55 micron
Tema Archive | 1994|Keywords: Multilayer-Technik (Schaltung) -
32 Gbit/s super-dynamic decision IC using 0.13 micron GaAs MESFETs with multilayer-interconnection structure
Tema Archive | 1997|Keywords: Multilayer-Technik (Schaltung) -
50 nm resolution, defect-free, electron-beam resists produced with monomer/polymer multilayer films
Tema Archive | 1983|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Ablative photodecomposition process for repair of line shorts (using UV laser)
Tema Archive | 1984|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
A bonding technique for thin GaAs dice with via holes using gold-tin composites
Tema Archive | 1991|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Accelerated life testing and reliability of high K multilayer ceramic capacitors
Tema Archive | 1982|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
A comparison of reactive ion beam milling and reactive ion etching for multilevel resist patterning
Tema Archive | 1984|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
A comparison of thin film, thick film, and co-fired high density ceramic multilayer with the combined technology: T and T HDCM (thin film and thick film high density ceramic module)
Tema Archive | 1983|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Acoustooptical spectrometric monitoring of the uniformity and selectivity of plasma chemical etching of silicon structures
Tema Archive | 1991|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Actuating mechanism for high-density multilayer ceramic module
Tema Archive | 1979|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Actuation tab and tab attach metallurgy
Tema Archive | 1984|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Additive thin film technology for hybrid circuit fabrication
Tema Archive | 1985|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Advanced copper/polyimide hybrid technology
Tema Archive | 1986|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Advanced printed-circuit board design for high-performance computer applications
Tema Archive | 1982|Keywords: MULTILAYER-TECHNIK (SCHALTUNG) -
Advanced TFT SRAM cell technology using a phase-shift lithography
Tema Archive | 1995|Keywords: Multilayer-Technik (Schaltung)
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