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PHOTONIC PACKAGE LASER AREA MACRO-VOID PRESSURE RELIEF MICRO-CHANNELS
Free accessEuropean Patent Office | 2021| -
On-Board Package Decapsulation Techniques for Failure Analysis
British Library Conference Proceedings | 2015| -
Apparatus and method for conformal coating of integrated circuit packages
Free accessEuropean Patent Office | 2019| -
Wetting Transition in Cylindrical Alumina Nanopores with Polymer Melts
American Chemical Society | 2006| -
Decoupling layer to reduce underfill stress in semiconductor devices
Free accessEuropean Patent Office | 2023| -
Silicon photonic integrated lens compatible with wafer processing
Free accessEuropean Patent Office | 2024| -
DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
Free accessEuropean Patent Office | 2021| -
SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING
Free accessEuropean Patent Office | 2021| -
MULTIPLE METAL LAYERS WITHIN A PHOTONICS INTEGRATED CIRCUIT FOR THERMAL TRANSFER
Free accessEuropean Patent Office | 2022| -
SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FROM UNDERFILL CONTACT
Free accessEuropean Patent Office | 2023|
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