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`Biodiversity: curse or opportunity for the mineral extraction industry?'
Humphries, N. / Horton, P. / Foster, R. et al. | British Library Conference Proceedings | 1999Contributors: Smith, M. R. -
[^3H] Imipramine binding in brain samples from depressed suicides and controls: 5-HT uptake sites compared with sites defined by desmethylimipramine
Lawrence, K. M. / Kanagasundaram, M. / Lowther, S. et al. | British Library Online Contents | 1998 -
$ 40^{th} $ EASD Annual Meeting of the European Association for the Study of Diabetes
Veitenhansl, M. / Wajman, A. / Tadgell, C. et al. | Online Contents | 2004 -
$ZZ \to \ell^{+}\ell^{-}\ell^{\prime +}\ell^{\prime -}$ cross-section measurements and search for anomalous triple gauge couplings in 13 TeV $pp$ collisions with the ATLAS detector
Aaboud, Morad / Aad, Georges / Abbott, Brad et al. | DataCite | 2018 -
1,1′,2,2′-Tetralithioferrocene and 1,1′,2,2′,3,3′-Hexalithioferrocene: Useful Additions to Ferrocene Precursor Compounds
Butler, Ian R. / Evans, Daniel M. / Horton, Peter N. et al. | American Chemical Society | 2021 -
2-Substituted 1,3-Indandiones
National licenceHORTON, R. L. / MURDOCK, K. C. | American Chemical Society | 1960 -
2-Substituted 4,5-dihydrothiazole-4-carboxylic acids are novel inhibitors of metallo-b-lactamases
Chen, P. / Horton, L. B. / Mikulski, R. L. et al. | British Library Online Contents | 2012 -
3BV.4.8 Hydrogen and Argon as p and n Type Doping Gas Mixtures: Impact on the Efficiency and Stability of Sputtered Amorphous Silicon Solar Cells
Kaur, R. / James, P.A.B. / Bahaj, A.S. et al. | British Library Conference Proceedings | 2009 -
3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections
Sakuma, K / Andry, P.S. / Dang, B. et al. | IEEE | 2007 -
3D chip stacking technology with low-volume lead-free interconnections
Sakuma, K. / Andry, P.S. / Dang, B. et al. | Tema Archive | 2007 -
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K. / Andry, P. S. / Tsang, C. K. et al. | IEEE | 2008 -
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, Katsuyuki / Andry, Paul S. / Tsang, Cornelia K. et al. | Tema Archive | 2008 -
3D chip stacking with C4 technology
Dang, Bing / Wright, Steven L. / Andry, Paul S. et al. | Tema Archive | 2008 -
3D Evolution of the Boundary Layer Formed During the Expansion of a Laserplasma in a Magnetic Field in Vacuum
Presura, R. / Sotnikov, V. I. / Ivanov, V. V. et al. | IEEE | 2005 -
3D Gyrokinetic Particle Simulations of Ion Temperature Gradient-Driven Turbulence and Transport
Sydora, R. D. / American Institute of Physics / US-Japan Joint Institute for Fusion Theory | British Library Conference Proceedings | 1994Contributors: Horton, W. -
3-D reconstruction of atherosclerotic foam cells using tomosynthesis
Grant, K. W. / Webber, R. / Horton, R. et al. | British Library Online Contents | 1994
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