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Passive Components in Electronic Applications: Requirements and Prospects for Integration
British Library Conference Proceedings | 1996| -
A Comparative Analysis of High Density PWB Technologies
British Library Conference Proceedings | 1996| -
Slimcase - An Ultra Thin Chip Size Integrated Circuit Package
British Library Conference Proceedings | 1996| -
Demonstration of a Chip Scale, Chip-on-Flex Technology
British Library Conference Proceedings | 1996| -
Using Topological Die Mapping with Electrical Fault Detection to Improve Yield in Known Good Die MCMs
British Library Conference Proceedings | 1996| -
The Modular Design and Realization of a 35 GHz Phase Shifter Receiver
British Library Conference Proceedings | 1996| -
Novel Low Cost Process Technologies for Application and Curing of Polyimide Films
British Library Conference Proceedings | 1996| -
Ultrasonic Bonding Tools for Fine Pitch, High Reliability Interconnect
British Library Conference Proceedings | 1996| -
Thermal Management Approach for a Scalable, MCM-Based System
British Library Conference Proceedings | 1996| -
Performance Comparison of Discrete and Buried Capacitors
British Library Conference Proceedings | 1996| -
Development and Characterization of a Few-Chip Module Housing a DC-DC Power Supply
British Library Conference Proceedings | 1996| -
Performance Comparison of Discrete and Buried Capacitors
British Library Conference Proceedings | 1996| -
A Pragmatic Look at Wafer Level Burn-In: The Wafer-Level Known Good Die Consortium
British Library Conference Proceedings | 1996| -
A 480-MFLOP MCM Based on the Sharp DSP Chip, Breaks the MCM Cost Barrier
British Library Conference Proceedings | 1996| -
Advanced MCM-Ds Break the I/O Bottleneck with Embedded Area-Array Integrated Circuits
British Library Conference Proceedings | 1996|
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