IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 666
-
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic PackagingBasaran, C. / Yujun Wen, et al. | 2006
- 674
-
Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA PackageChong, D.Y.R. / Lim, B.K. / Rebibis, K.J. et al. | 2006
- 683
-
Epitaxy-Like Protective Layers for High-Performance Low-Cost Au/Pd/Ni Preplated Cu Alloy LeadframesLilin Liu, / Deming Liu, / Ran Fu, et al. | 2006
- 690
-
Thermal Fatigue of SnPb and SAC Resistor Joints: Analysis of Stress-Strain as a Function of Cycle ParametersYan Qi, / Ghorbani, H.R. / Spelt, J.K. et al. | 2006
- 701
-
Anisotropic Conductive Film Bonding by Making Use of a High-Power Diode LaserKwang Hyun Ryu, / Namic Kwon, / Myung Hee Seo, et al. | 2006
- 707
-
Effect of Chromium–Gold and Titanium–Titanium Nitride–Platinum–Gold Metallization on Wire/Ribbon BondabilityJianbiao Pan, / Pafchek, R.M. / Judd, F.F. et al. | 2006
- 714
-
A Study of Permittivity Measurement Reproducibility Utilizing the Agilent 4291BHill, M.J. / Wojewoda, L.E. et al. | 2006
- 719
-
Fluidic Assembly of Optical ComponentsAvital, A. / Zussman, E. et al. | 2006
- 725
-
Thermosonic Flip Chip Interconnection Using Electroplated Copper Column ArraysGao, S. / Holmes, A.S. et al. | 2006
- 735
-
Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible PackagesChan, Y.C. / Tan, S.C. / Lui, N.S.M. et al. | 2006
- 741
-
Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material Curable in AirYing-Hung So, / Stark, E.J. / Yongfu Li, et al. | 2006
- 751
-
Advances in Vapor Pressure Modeling for Electronic PackagingWong, E.H. / Koh, S.W. / Lee, K.H. et al. | 2006
- 760
-
Hermetic Packaging Using Eutectic SnPb Solder and Cr/Ni/Cu Metallurgy LayerHuang, A.T. / Chung-Kuang Chou, / Chih Chen, et al. | 2006
- 766
-
Three-Optical-Port Module for Monolithic Optical Gate Integrated With Photodiode and Electroabsorption ModulatorYoshino, K. / Yoshimatsu, T. / Kodama, S. et al. | 2006
- 770
-
Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICsXiaomeng Shi, / Kiat Seng Yeo, / Jian-Guo Ma, et al. | 2006
- 777
-
Design and Characterization of Purely Textile Patch AntennasLocher, I. / Klemm, M. / Kirstein, T. et al. | 2006
- 789
-
A Time-Domain Approach for Extracting Broadband Macro-p Models of Differential Via HolesWang, C.-C. et al. | 2006
- 789
-
A Time-Domain Approach for Extracting Broadband Macro- $\pi$ Models of Differential Via HolesChen-Chao Wang, / Chih-Wen Kuo, / Chun-Chih Kuo, et al. | 2006
- 798
-
Effect of Current Crowding on Frequency Response of a Stepped Planar RF Transmission-Line Lowpass Filter for Power ElectronicsCampbell, C.D. / van Wyk, J.D. / Rengang Chen, et al. | 2006
- 804
-
A Fully Embedded 60-GHz Novel BPF for LTCC System-in-Package ApplicationsYoung Chul Lee, / Chul Soon Park, et al. | 2006
- 810
-
High-$Q$ Above-IC Inductors Using Thin-Film Wafer-Level Packaging Technology Demonstrated on 90-nm RF-CMOS 5-GHz VCO and 24-GHz LNAXiao Sun, / Dupuis, O. / Linten, D. et al. | 2006
- 818
-
IEEE Transactions on Components and Packaging Technolog - Table of contents| 2006
- 820
-
IEEE Transactions on Electronics Packaging Manufacturing - Table of contents| 2006
- 821
-
2006 Index| 2006
- 836
-
Have you visited lately? www.ieee.org| 2006
- C1
-
Table of contents| 2006
- C2
-
IEEE Transactions on Advanced Packaging publication information| 2006
- C3
-
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2006
- C4
-
IEEE Components, Packaging, and Manufacturing Technology Society Information| 2006