IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 347
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Characterization of electromagnetic systems using Pade approximation with expansion at infinityZhou, Tingdong / Dvorak, S.L. / Prince, J.L. et al. | 2003
- 347
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Characterization of electromagnetic systems using Pade/spl acute/ approximation with expansion at infinityTingdong Zhou, / Dvorak, S.L. / Prince, J.L. et al. | 2003
- 353
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Application of subspace projection approaches for reduced-order modeling of electromagnetic systemsTingdong Zhou, / Dvorak, S.L. / Prince, J.L. et al. | 2003
- 361
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Matched coupled microstrip transistor amplifier methodologyNickel, J.G. / Schutt-Aine, J.E. et al. | 2003
- 368
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Analysis of a double step microstrip discontinuity using generalized transmission line equationsYaowu Liu, / Jingsong Hong, / Mei, K.K. et al. | 2003
- 375
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Coupling of vias in electronic packaging and printed circuit board structures with finite ground planeLeung Tsang, / Miller, D. et al. | 2003
- 385
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Modeling and design for electrical performance of wideband flip-chip transitionWang, C.-L. / Ruey-Beei Wu, et al. | 2003
- 392
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A compact multilayer IC package model for efficient simulation, analysis, and design of high-performance VLSI circuitsYungseon Eo, / Eisenstadt, W.R. / Woojin Jin, et al. | 2003
- 402
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An enhanced quasi-monolithic integration technology for microwave and millimeter wave applicationsJoodaki, M. / Kompa, G. / Hillmer, H. et al. | 2003
- 410
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Random network model for heat transfer in high contrast composite materialsGerenrot, D. / Berlyand, L. / Phillips, J. et al. | 2003
- 417
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A solder-free interconnect approach for integrating millimeter wave high-power devices with planar circuitryChoudhury, D. / Lawyer, P.H. / Foschaar, J.A. et al. | 2003
- 425
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Application of multiobjective optimization in selection of printed wiring boardsQishan Li, / Palusinski, O.A. et al. | 2003
- 433
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Impact of flip-chip packaging on copper/low-k structuresMercado, L.L. / Kuo, S.-M. / Goldberg, C. et al. | 2003
- 441
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Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: modeling and evaluationWeidong Xie, / Sitaraman, S.K. et al. | 2003
- 447
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Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: experimental characterizationWeidong Xie, / Sitaraman, S.K. et al. | 2003
- 453
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Discussion of "Microprocessor-Controlled New Class of Optimal Battery Chargers for Photovoltaic Applications"Mercado, L.L. / Wieser, H. / Hauck, T. et al. | 2003
- 454
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Author index| 2003
- 457
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Subject index| 2003