IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 1
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Three-dimensional flip-chip on flex packaging for power electronics applicationsXingsheng Liu, / Haque, S. / Guo-Quan Lu, et al. | 2001
- 10
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Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shearFan, S.H. / Chan, Y.C. / Tang, C.W. et al. | 2001
- 17
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The effects of underfill and its material models on thermomechanical behaviors of a flip chip packageLiu Chen, / Qun Zhang, / Guozhoag Wang, et al. | 2001
- 25
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Reliability studies mu BGA solder joints-effect of Ni-Sn intermetallic compoundChan, Y.C. / Tu, P.L. / Tang, C.W. et al. | 2001
- 25
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Reliability studies /spl mu/BGA solder joints-effect of Ni-Sn intermetallic compoundChan, Y.C. / Tu, P.L. / Tang, C.W. et al. | 2001
- 33
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Significance of coating stress on substrate bow in large area processing of MCMKwanho Yang, / Jang-Hi Im, / Heistand, R.H. et al. | 2001
- 37
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Development of microwave multilayer plastic-based multichip modulesPham, A.-V.H. / Sutono, A. / Laskar, J. et al. | 2001
- 41
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Multilayer planarization of polymer dielectricsChiniwalla, P. / Manepalli, R. / Farnsworth, K. et al. | 2001
- 54
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A novel high speed multitap bus structureBarber, V.A. / Keunmyung Lee, / Obermaier, H. et al. | 2001
- 60
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Simulating package behavior under power dissipation using uniform thermal loadingWakil, J.A. / Ho, P.S. et al. | 2001
- 66
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Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shockMercado, L.L. / Tien-Yu Lee, / Cook, J. et al. | 2001
- 76
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Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packagesPonchak, G.E. / Donghoon Chun, / Jong-Gwan Yook, et al. | 2001
- 81
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Post-weld-shift in dual-in-line laser packageJao-Hwa Kuang, / Maw-Tyan Sheen, / Szu-Chun Wang, et al. | 2001
- 86
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Central wavelength tunable mechanism for temperature compensated package of fiber Bragg gratingsHsi-Hsun Tsai, / Win-Yann Jang, / Fen-Fen Yeh, et al. | 2001
- 91
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A 100-Gb/s throughput ATM switch MCM with a 320-channel parallel optical I/O interfaceKawano, R. / Yamanaka, N. / Oki, E. et al. | 2001
- 99
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A method of investigating fine shorting whiskers within a leadframe molded packageYen, A.C. / Zheng Hongyu, / Wynn, R.T. et al. | 2001
- 104
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Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesiveAsai, H. / Iwase, N. / Suga, T. et al. | 2001