The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Volume 30,
Issue 5
Volume 30,
Issue 4
Volume 30,
Issue 3
Volume 30,
Issue 1
Volume 29,
Issue 12
Volume 29,
Issue 11
Volume 29,
Issue 10
Volume 29,
Issue 9
Volume 29,
Issue 8
Volume 29,
Issue 7
Volume 29,
Issue 6
Volume 29,
Issue 5
Volume 29,
Issue 4
Volume 29,
Issue 3
Volume 29,
Issue 2
Volume 29,
Issue 1
Volume 28,
Issue 12
Volume 28,
Issue 11
Volume 28,
Issue 10
Volume 28,
Issue 9
Volume 28,
Issue 8
Volume 28,
Issue 7
Volume 28,
Issue 6
Volume 28,
Issue 5
Volume 28,
Issue 4
Volume 28,
Issue 3
Volume 28,
Issue 2
Volume 28,
Issue 1
Volume 27,
Issue 12
Volume 27,
Issue 11
Volume 27,
Issue 10
Volume 27,
Issue 9
Volume 27,
Issue 8
Volume 27,
Issue 7
Volume 27,
Issue 6
Volume 27,
Issue 5
Volume 27,
Issue 4
Volume 27,
Issue 3
Volume 27,
Issue 2
Volume 27,
Issue 1
Volume 26,
Issue 12
Volume 26,
Issue 11
Volume 26,
Issue 10
Volume 26,
Issue 9
Volume 26,
Issue 8
Volume 26,
Issue 7
Volume 26,
Issue 6
Volume 26,
Issue 5
Volume 26,
Issue 4
Volume 26,
Issue 3
Volume 26,
Issue 2
Volume 26,
Issue 1
Volume 25,
Issue 12
Volume 25,
Issue 11
Volume 25,
Issue 10
Volume 25,
Issue 9
Volume 25,
Issue 8
Volume 25,
Issue 7
Volume 25,
Issue 6
Volume 25,
Issue 5
Volume 25,
Issue 4
Volume 25,
Issue 3
Volume 25,
Issue 2
Volume 25,
Issue 1
Volume 24,
Issue 12
Volume 24,
Issue 11
Volume 24,
Issue 10
Volume 24,
Issue 9
Volume 24,
Issue 8
Volume 24,
Issue 7
Volume 24,
Issue 6
Volume 24,
Issue 5
Volume 24,
Issue 4
Volume 24,
Issue 3
Volume 24,
Issue 2
Volume 24,
Issue 1
Volume 23,
Issue 12
Volume 23,
Issue 11
Volume 23,
Issue 10
Volume 23,
Issue 9
Volume 23,
Issue 8
Volume 23,
Issue 7
Volume 23,
Issue 6
Volume 23,
Issue 5
Volume 23,
Issue 4
Volume 23,
Issue 3
Volume 23,
Issue 2
Volume 23,
Issue 1
Volume 22,
Issue 12
Volume 22,
Issue 11
Volume 22,
Issue 10
Volume 22,
Issue 9
Volume 22,
Issue 8
Volume 22,
Issue 7
Volume 22,
Issue 6
Volume 22,
Issue 5
Volume 22,
Issue 4
Volume 22,
Issue 3
Volume 22,
Issue 2
Volume 22,
Issue 1
Volume 21,
Issue 12
Volume 21,
Issue 11
Volume 21,
Issue 10
Volume 21,
Issue 9
Volume 21,
Issue 8
Volume 21,
Issue 7
Volume 21,
Issue 6
Volume 21,
Issue 5
Volume 21,
Issue 4
Volume 21,
Issue 3
Volume 21,
Issue 2
Volume 21,
Issue 1
Volume 20,
Issue 12
Volume 20,
Issue 11
Volume 20,
Issue 10
Volume 20,
Issue 9
Volume 20,
Issue 8
Volume 20,
Issue 7
Volume 20,
Issue 6
Volume 20,
Issue 5
Volume 20,
Issue 4
Volume 20,
Issue 3
Volume 20,
Issue 2
Volume 20,
Issue 1
Volume 19,
Issue 12
Volume 19,
Issue 11
Volume 19,
Issue 10
Volume 19,
Issue 9
Volume 19,
Issue 8
Volume 19,
Issue 7
Volume 19,
Issue 6
Volume 19,
Issue 5
Volume 19,
Issue 4
Volume 19,
Issue 3
Volume 19,
Issue 2
Volume 19,
Issue 1
Volume 18,
Issue 12
Volume 18,
Issue 11
Volume 18,
Issue 10
Volume 18,
Issue 9
Volume 18,
Issue 8
Volume 18,
Issue 7
Volume 18,
Issue 6
Volume 18,
Issue 5
Volume 18,
Issue 4
Volume 18,
Issue 3
Volume 18,
Issue 2
Volume 18,
Issue 1
Volume 17,
Issue 12
Volume 17,
Issue 11
Volume 17,
Issue 10
Volume 17,
Issue 9
Volume 17,
Issue 8
Volume 17,
Issue 7
Volume 17,
Issue 5
Volume 17,
Issue 4
Volume 17,
Issue 3
Volume 17,
Issue 2
Volume 17,
Issue 1
Volume 16,
Issue 12
Volume 16,
Issue 11
Volume 16,
Issue 10
Volume 16,
Issue 9
Volume 16,
Issue 8
Volume 16,
Issue 7
Volume 16,
Issue 6
Volume 16,
Issue 5
Volume 16,
Issue 4
Volume 16,
Issue 3
Volume 16,
Issue 2
Volume 16,
Issue 1
Volume 15,
Issue 12
Volume 15,
Issue 11
Volume 15,
Issue 10
Volume 15,
Issue 9
Volume 15,
Issue 8
Volume 15,
Issue 7
Volume 15,
Issue 6
Volume 15,
Issue 5
Volume 15,
Issue 4
Volume 15,
Issue 3
Volume 15,
Issue 2
Volume 15,
Issue 1
Volume 14,
Issue 12
Volume 14,
Issue 11
Volume 14,
Issue 9
Volume 14,
Issue 8
Volume 14,
Issue 7
Volume 14,
Issue 6
Volume 14,
Issue 5
Volume 14,
Issue 4
Volume 14,
Issue 3
Volume 14,
Issue 2
Volume 14,
Issue 1
Volume 13,
Issue 12
Volume 13,
Issue 11
Volume 13,
Issue 10
Volume 13,
Issue 8
Volume 13,
Issue 7
Volume 13,
Issue 6
Volume 13,
Issue 5
Volume 13,
Issue 4
Volume 13,
Issue 3
Volume 13,
Issue 2
Volume 13,
Issue 1
Volume 12,
Issue 12
Volume 12,
Issue 11
Volume 12,
Issue 10
Volume 12,
Issue 9
Volume 12,
Issue 8
Volume 12,
Issue 7
Volume 12,
Issue 6
Volume 12,
Issue 5
Volume 12,
Issue 4
Volume 12,
Issue 3
Volume 12,
Issue 2
Volume 12,
Issue 1
Volume 11,
Issue 12
Volume 11,
Issue 11
Volume 11,
Issue 10
Volume 11,
Issue 8
Volume 11,
Issue 7
Volume 11,
Issue 6
Volume 11,
Issue 4
Volume 11,
Issue 2
Volume 11,
Issue 1
Volume 10,
Issue 10
Volume 10,
Issue 8
Volume 10,
Issue 6
Volume 10,
Issue 5
Volume 10,
Issue 4
Volume 10,
Issue 3
Volume 10,
Issue 2
Volume 10,
Issue 1
Volume 9,
Issue 8
Volume 9,
Issue 6
Volume 9,
Issue 5
Volume 9,
Issue 4
Volume 9,
Issue 3
Volume 9,
Issue 1
Volume 8,
Issue 6
Volume 8,
Issue 4
Volume 8,
Issue 2
Volume 8,
Issue 1
Volume 7,
Issue 5
Volume 7,
Issue 4
Volume 7,
Issue 3
Volume 7,
Issue 2
Volume 7,
Issue 1
Volume 6,
Issue 6
Volume 6,
Issue 5
Volume 6,
Issue 4
Volume 6,
Issue 3
Volume 6,
Issue 2
Volume 6,
Issue 1
Volume 5,
Issue 4
Volume 5,
Issue 3
Volume 5,
Issue 2
Volume 5,
Issue 1
Volume 4,
Issue 4
Volume 4,
Issue 3
Volume 4,
Issue 2
Volume 4,
Issue 1
Volume 3,
Issue 4
Volume 3,
Issue 3
Volume 3,
Issue 2
Volume 3,
Issue 1
Volume 2,
Issue 4
Volume 2,
Issue 3
Volume 2,
Issue 2
Volume 2,
Issue 1
Volume 1,
Issue 4
Volume 1,
Issue 3
Volume 1,
Issue 2
Volume 1,
Issue 1
>
Table of contents
377
Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle
Michel, Bernd
/ Bagdahn, Jörg
et al.
| 2006
378
Surface plasma treatments enabling low temperature direct bonding
Moriceau, Hubert
/ Rieutord, François
/ Morales, Christophe
et al.
| 2005
383
Effect of interfacial $ SiO_{2} $ thickness for low temperature $ O_{2} $ plasma activated wafer bonding
Olbrechts, Benoit
/ Zhang, Xuanxiong
/ Bertholet, Yannick
et al.
| 2005
391
Direct bonding with on-wafer metal interconnections
Jia, C.
/ Wiemer, M.
/ Gessner, T.
et al.
| 2005
397
Wafer direct bonding with ambient pressure plasma activation
Gabriel, Markus
/ Johnson, Brad
/ Suss, Ralf
et al.
| 2006
401
Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)
Luoto, H.
/ Suni, T.
/ Kulawski, M.
et al.
| 2005
406
Bonded thick film SOI with pre-etched cavities
Suni, Tommi
/ Henttinen, Kimmo
/ Dekker, James
et al.
| 2006
413
Discussion of tooling solutions for the direct bonding of silicon wafers
Aitken, Nick
/ Rogers, Tony
et al.
| 2006
418
Versatile low temperature wafer bonding and bond strength measurement by a blister test method
Doll, Alexander
/ Rabold, Martin
/ Goldschmidtböing, Frank
et al.
| 2005
430
Influence of the frequency on fatigue of directly wafer-bonded silicon
Bagdahn, Jörg
/ Bernasch, Michael
/ Petzold, Matthias
et al.
| 2005
436
Fabrication of microfluidic networks with integrated electrodes
Hermes, D. C.
/ Heuser, T.
/ Wouden, E. J. van der
et al.
| 2005
450
Fabrication and mechanical testing of glass chips for high-pressure synthetic or analytical chemistry
Oosterbroek, R. E.
/ Hermes, D. C.
/ Kakuta, M.
et al.
| 2005
455
Transfer of small structures by bonding
Villanueva, G.
/ Plaza, J.A.
/ González, E.
et al.
| 2005
462
A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
Knechtel, R.
/ Knaup, M.
/ Bagdahn, J.
et al.
| 2005
468
Wafer level encapsulation of microsystems using glass frit bonding
Knechtel, R.
/ Wiemer, M.
/ Frömel, J.
et al.
| 2005
473
Mechanical properties of glass frit bonded micro packages
Dresbach, C.
/ Krombholz, A.
/ Ebert, M.
et al.
| 2005
481
Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems
Frömel, J.
/ Billep, D.
/ Geßner, T.
et al.
| 2005
Anodic bonding of glass to aluminium
Schjølberg-Henriksen, K.
/ Poppe, E.
/ Moe, S.
et al.
| 2005