IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 240
-
Modeling of Power Distribution Systems for High-Performance MicroprocessorsHerrell, D. J. / Beker, B. et al. | 1999
- 249
-
Contribution of Resonance to Ground Bounce in Lossy Thin Film PlanesPannala, S. / Bandyopadhyay, J. / Swaminathan, M. et al. | 1999
- 259
-
Accurate Power Supply and Ground Plane Pair ModelsWu, H. H. / Meyer, J. W. / Lee, K. et al. | 1999
- 267
-
S-Parameter Based Technique for Simultaneous Switching Noise Analysis in Electronic PackagesJin, Z. / Iyer, M. K. / Qiu, Y. et al. | 1999
- 274
-
Reducing Simultaneous Switching Noise and EMI on Ground/Power Planes by Dissipative Edge TerminationNovak, I. et al. | 1999
- 284
-
Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS TechnologySmith, D. L. / Anderson, R. E. / Forehand, D. W. et al. | 1999
- 292
-
Frequency-Dependent Crosstalk Simulation for On-Chip InterconnectionsDeutsch, A. / Smith, H. H. / Surovic, C. W. et al. | 1999
- 309
-
Modeling and Electrical Analysis of Seamless High Off-Chip Connectivity (SHOCC) InterconnectsAfonso, S. / Schaper, L. W. / Parkerson, J. P. et al. | 1999
- 321
-
Electrical Performance of Chip-on-Chip ModulesLow, Y. L. / O'Connor, K. J. et al. | 1999
- 326
-
RF/Microwave Characterization of Multilayer Ceramic-Based MCM TechnologySutono, A. / Pham, A.-V. H. / Laskar, J. et al. | 1999
- 332
-
Spiral Transmission-Line Baluns for RF Multichip Module PackagesYoon, Y. J. / Lu, Y. / Frye, R. C. et al. | 1999
- 337
-
Electrical Characterization of Integrated Circuit Molding CompoundGreen, C. C. / Seligman, J. M. / Prince, J. L. et al. | 1999
- 343
-
Electrical Characterization of Ball Grid Array Packages from S-Parameter Measurements Below 500 MHzJeong, J. / Nam, S. / Shin, Y. S. et al. | 1999
- 348
-
Efficient Computation of Interconnect Capacitances Using the Domain Decomposition ApproachVeremey, V. V. / Mittra, R. et al. | 1999
- 356
-
A New Discrete Transmission Line Model for Passive Model Order Reduction and Macromodeling of High-Speed InterconnectionsCangellaris, A. C. / Pasha, S. / Prince, J. L. et al. | 1999
- 366
-
Packaging Properties of ALIVH-CSP using SBB Flip-Chip Bonding TechnologyItagaki, M. / Amami, K. / Tomura, Y. et al. | 1999
- 372
-
Evolution of a Unique Flip-Chip MCM-L PackageJimarez, M. A. / Tran, S. / Le Coz, C. et al. | 1999
- 379
-
Thermal Management for Multifunctional StructuresRawal, S. P. / Barnett, D. M. / Martin, D. E. et al. | 1999
- 385
-
Epoxy-Based Aqueous-Processable Photodielectric Dry Film and Conductive ViaPlug for PCB Build-Up and IC PackagingGonzalez, C. G. / Wessel, R. A. / Padlewski, S. A. et al. | 1999
- 391
-
High Reliability, High Density, Low Cost Packaging Systems for Matrix Systems for Matrix BGA and CSP by VPES (Vacuum Printing Encapsulation Systems)Okuno, A. / Fujita, N. / Ishikawa, Y. et al. | 1999
- 398
-
A Novel High Performance Adhesion Enhancing Zn-Cr Leadframe Coating for Popcorn PreventionLee, C. / Hoesler, W. / Cerva, H. et al. | 1999
- 407
-
Electrical Evaluation of Flip-Chip Package Alternatives for Next Generation MicroprocessorsDarnauer, J. / Chengson, D. / Schmidt, B. et al. | 1999
- 416
-
Electrical Design and Simulation of High Density Printed Circuit BoardsSwirbel, T. / Naujoks, A. / Watkins, M. et al. | 1999
- 424
-
A 3-D-Stacked Chip Packaging Solution for Miniaturized Massively Parallel ProcessingLea, R. M. / Jalowiecki, I. P. / Boughton, D. K. et al. | 1999
- 433
-
Mechatronics for Automotive and Industrial ApplicationsTriantafyllou, M. / Neumann, K.-T. / Reichl, H. et al. | 1999
- 442
-
Ten-Channel Optical Transmitter Module for Subsystem Interconnection Operating at lambda = 1.3 m Up to 12.5 Gbit/sBostica, B. / Burzio, M. / Delpiano, F. et al. | 1999
- 451
-
A Compact MU-Interface, 2.5-Gb/s Optical Transmitter Module with LD-Driver IC Embedded in L-Shaped Wiring SubstrateIshitsuka, F. / Iwasaki, N. / Hirose, M. et al. | 1999
- 460
-
Design and Characteristics of a Newly Developed Cavity-Up Plastic and Ceramic Laminated Thin BGA PackageAsai, H. / Yano, K. / Iyogi, K. et al. | 1999
- 468
-
Thermosonic Flip Chip Bonding System with a Self-Planarization Feature Using PolymerTan, Q. / Schaible, B. / Bond, L. J. et al. | 1999
- 476
-
Transient Two-Dimensional Thermal Analysis of Electronic Packages by the Boundary Element MethodGuven, I. / Chan, C. L. / Madenci, E. et al. | 1999
- 487
-
Stress-Buffer and Passivation Processes for Si and GaAs IC's and Passive Components Using Photosensitive BCB: Process Technology and Reliability DataGarrou, P. E. / Rogers, W. B. / Scheck, D. M. et al. | 1999
- 499
-
Characterization of Thin Film Tantalum Oxide Capacitors on Polyimide SubstratesMorcan, G. / Ang, S. S. / Lenihan, T. et al. | 1999
- 510
-
Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale CopperHeino, P. / Ristolainen, E. et al. | 1999
- 515
-
Moisture Sensitivity Characterization of Build-Up Ball Grid Array SubstratesPecht, M. G. et al. | 1999
- 524
-
Correction to "Frequency response characteristics of reference plane effective inductance and resistance"Xuebing Xie, / Prince, J.L. et al. | 1999