IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
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Table of contents| 2005
- 531
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SPECIAL SECTION ON PACKAGING FOR MICRO- AND NANOSCALE SYSTEMS - ForewordLee, Y.C. et al. | 2005
- 531
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Foreword Special Section on Micro- and Nanoscale PackagingLee, Y.C. / Chiou, J.A. / Velten, T. et al. | 2005
- 533
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Packaging of bio-MEMS: strategies, technologies, and applicationsVelten, T. / Ruf, H.H. / Barrow, D. et al. | 2005
- 533
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SPECIAL SECTION PAPERS - Packaging of Bio-MEMS: Strategies, Technologies, and ApplicationsVelten, T. et al. | 2005
- 547
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Actin-Based Molecular Motors for Cargo Transportation in Nanotechnology- Potentials and ChallengesMansson, A. / Sundberg, M. / Bunk, R. et al. | 2005
- 547
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SPECIAL SECTION PAPERS - Actin-Based Molecular Motors for Cargo Transportation in Nanotechnology -- Potentials and ChallengesMånsson, A. et al. | 2005
- 547
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Actin-Based Molecular Motors for Cargo Transportation in Nanotechnology— Potentials and ChallengesMansson, A. / Sundberg, M. / Bunk, R. et al. | 2005
- 556
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Packaging actomyosin-based biomolecular motor-driven devices for nanoactuator applicationsGrove, T.J. / Puckett, K.A. / Brunet, N.M. et al. | 2005
- 556
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SPECIAL SECTION PAPERS - Packaging Actomyosin-Based Biomolecular Motor-Driven Devices for Nanoactuator ApplicationsGrove, T.J. et al. | 2005
- 564
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Microfabricated capped channels for biomolecular motor-based transportYing-Ming Huang, / Uppalapati, M. / Hancock, W.O. et al. | 2005
- 564
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SPECIAL SECTION PAPERS - Microfabricated Capped Channels for Biomolecular Motor-Based TransportHuang, Y.M. et al. | 2005
- 571
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Kinesin-driven sorting machine on large-scale microtubule arraysBohm, K.J. / Beeg, J. / Meyer zu Horste, G. et al. | 2005
- 571
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SPECIAL SECTION PAPERS - Kinesin-Driven Sorting Machine on Large-Scale Microtubule ArraysBöhm, K.J. et al. | 2005
- 577
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Evaluation of cryopreserved microtubules immobilized in microfluidic channels for a bead-assay-based transportation systemYokokawa, R. / Yoshida, Y. / Takeuchi, S. et al. | 2005
- 577
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SPECIAL SECTION PAPERS - Evaluation of Cryopreserved Microtubules Immobilized in Microfluidic Channels for a Bead-Assay-Based Transportation SystemYokokawa, R. et al. | 2005
- 584
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Micro- and nanofabrication processes for hybrid synthetic and biological system fabricationVerma, V. / Hancock, W.O. / Catchmark, J.M. et al. | 2005
- 584
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SPECIAL SECTION PAPERS - Micro- and Nanofabrication Processes for Hybrid Synthetic and Biological System FabricationVerma, V. et al. | 2005
- 594
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Caged ATP-fuel for bionanodevicesWu, D. / Tucker, R. / Hess, H. et al. | 2005
- 594
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SPECIAL SECTION PAPERS - Caged ATP -- Fuel for BionanodevicesWu, D. et al. | 2005
- 600
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Self-assembly for microscale and nanoscale packaging: steps toward self-packagingMorris, C.J. / Stauth, S.A. / Parviz, B.A. et al. | 2005
- 600
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SPECIAL SECTION PAPERS - Self-Assembly for Microscale and Nanoscale Packaging: Steps Toward Self-PackagingMorris, C.J. et al. | 2005
- 612
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MOEMS chip-level optical fiber interconnectDeeds, M.A. / Sandborn, P.A. et al. | 2005
- 612
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SPECIAL SECTION PAPERS - MOEMS Chip-Level Optical Fiber InterconnectDeeds, M.A. et al. | 2005
- 619
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SPECIAL SECTION PAPERS - A Micromachined Pirani Gauge With Dual Heat SinksChae, J. et al. | 2005
- 619
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A micromachined Pirani gauge with dual heat sinksJunseok Chae, / Stark, B.H. / Najafi, K. et al. | 2005
- 626
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SPECIAL SECTION PAPERS - Silicon-to-Steel Bonding Using Rapid Thermal AnnealingSosnowchik, B.D. et al. | 2005
- 626
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Silicon-to-steel bonding using rapid thermal annealingSosnowchik, B.D. / Azevedo, R.G. / Cao, A. et al. | 2005
- 635
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SPECIAL SECTION PAPERS - Localized Bonding Processes for Assembly and Packaging of Polymeric MEMSSu, Y.-C. et al. | 2005
- 635
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Localized bonding processes for assembly and packaging of polymeric MEMSYu-Chuan Su, / Lin, L. et al. | 2005
- 643
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SPECIAL SECTION PAPERS - Transfer of Metal MEMS Packages Using a Wafer-Level Solder Transfer TechniqueWelch III, W.C. et al. | 2005
- 643
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Transfer of metal MEMS packages using a wafer-level solder transfer techniqueWelch, W.C. / Junseok Chae, / Najafi, K. et al. | 2005
- 650
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SPECIAL SECTION PAPERS - Mathematical Model of Low-Temperature Wafer Bonding Under Medium Vacuum and its ApplicationYu, W.B. et al. | 2005
- 650
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Mathematical model of low-temperature wafer bonding under medium vacuum and its applicationWei Bo Yu, / Jun Wei, / Cher Ming Tan, et al. | 2005
- 659
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Density factor approach to representing impact of die power maps on thermal managementTorresola, J. / Chia-Pin Chiu, / Chrysler, G. et al. | 2005
- 665
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RF packaging and passives: design, fabrication, measurement, and validation of package embedded inductorsChickamenahalli, S.A. / Braunisch, H. / Srinivasan, S. et al. | 2005
- 674
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Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bondingYu Hin Chan, / Jang-Kyo Kim, / Deming Liu, et al. | 2005
- 685
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Wire-bonding process monitoring using thermopile temperature sensorSuman, S. / Gaitan, M. / Joshi, Y. et al. | 2005
- 694
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Dynamic compact thermal models with multiple power sources: application to an ultrathin chip stacking technologyPalacin, J. / Salleras, M. / Samitier, J. et al. | 2005
- 704
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Analytical modeling of thermal stresses in plated through via (PTV) structuresJin Ma, / Spelt, J.K. et al. | 2005
- 713
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A novel inspection of fiber post-weld-shift in butterfly laser module packagingYih-Tun Tseng, / Hsin-Chin Sung, et al. | 2005
- 720
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The effect of edge metal profiles on the accuracy of electrical modeling of advanced packagesKaw, R. / Burton, S. / Ching-Chao Huang, et al. | 2005
- 724
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Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boardsJingook Kim, / Heeseok Lee, / Joungho Kim, et al. | 2005
- 736
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Simulation of lossy package transmission lines using extracted data from one-port TDR measurements and nonphysical RLGC modelsWoopoung Kim, / Swaminathan, M. et al. | 2005
- 745
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A time-domain surface integral technique for mixed electromagnetic and circuit simulationChuanyi Yang, / Jandhyala, V. et al. | 2005
- 754
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Minimizing switching noise in a power distribution network using external coupled resistive terminationTsun-Hsu Chang, et al. | 2005
- 761
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Low-cost compact spiral inductor resonator filters for system-in-a-packageGye-An Lee, / Megahed, M.A. / De Flaviis, F. et al. | 2005
- 772
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RF characterization and modeling of various wire bond transitionsJuHwan Lim, / DaeHan Kwon, / Jae-Sung Rieh, et al. | 2005
- 779
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IEEE Transactions on Electronics Packaging Manufacturing table of contents| 2005
- 780
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IEEE Transactions on Components and Packaging Technology table of contents| 2005
- 782
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Quality without compromise| 2005
- 783
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2005 Index| 2005
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[Front cover]| 2005
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IEEE Transactions on Advanced Packaging publication information| 2005
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2005
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2005