IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 3
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Redistribution and bumping of a high I/O device for flip chip assemblyKeser, L.A. / Bajaj, R. / Fang, T. et al. | 2000
- 9
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On enhancing eutectic solder joint reliability using a second-reflow-process approachChiang, Kuo-Ning / Lin, Yung-Te / Cheng, Hsien-Chie et al. | 2000
- 15
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Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesiveYing Fu / Wang, Yanli / Wang, Xitao et al. | 2000
- 42
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Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasersFokken, G.J. / Walters, W.L. / Mattson, L.F. et al. | 2000
- 62
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An analytical model of simultaneous switching noise in CMOS systemsCha, Hye-Ran / Kwon, Oh-Kyong et al. | 2000
- 69
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Electromagnetic simulation of bonding wires and comparison with wide band measurementsSchuster, C. / Leonhardt, G. / Fichtner, W. et al. | 2000
- 80
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Nondestructive defect detection in multilayer ceramic capacitors using an improved digital speckle correlation method with wavelet packet noise reduction processingChan, Y.C. / Hung, K.C. / Dai, X. et al. | 2000
- 100
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Characterization of interfacial adhesion damage induced by accelerated life testingPark, Jongwoo / Harlow, D.G. / Nied, H.F. et al. | 2000
- 108
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Reliability of thick Al wire bonds in IGBT modules for traction motor drivesOnuki, J. / Koizumi, M. / Suwa, M. et al. | 2000
- 113
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Heat transfer from pin-fin heat sinks under multiple impinging jetsEl-Sheikh, H.A. / Garimella, S.V. et al. | 2000
- 121
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Correction to "Die-cracking and reliable die design for flip-chip assemblies"Michaelides, S. / Sitaraman, S.K. et al. | 2000