IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 111
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RF Flip-Module BGA PackageLow, Y. L. / Degani, Y. / Guinn, K. V. et al. | 1999
- 116
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New High-Density Multilayer Technology on PCBShimoto, T. / Matsui, K. / Kikuchi, K. et al. | 1999
- 123
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Overmold Technology Applied to Cavity Down Ultrafine Pitch PBGA PackageOuimet, S. / Paquet, M.-C. et al. | 1999
- 129
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Evolution of Engineering Change and Repair Technology in High Performance Multichip Modules at IBMPerfecto, E. D. / Ray, S. K. / Wassick, T. A. et al. | 1999
- 136
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An Innovative Technique for Packaging Power Electronic Building Blocks Using Metal Posts Interconnected Parallel Plate StructuresHaque, S. / Xing, K. / Lin, R.-L. et al. | 1999
- 145
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Hermetic-Equivalent Packaging of GPS MCM-L Modules for High Reliability Avionics ApplicationsHagge, J. K. / Camilletti, R. C. et al. | 1999
- 153
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Manufacturing Experience with High Performance Mixed Dielectric Circuit BoardsFarquhar, D. S. / Seman, A. M. / Poliks, M. D. et al. | 1999
- 160
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A CMOS Image Sensor Module Applied for a Digital Still Camera Utilizing the TAB on Glass (TOG) Bonding MethodSegawa, M. / Ono, M. / Musha, S. et al. | 1999
- 166
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The Contact Resistance and Reliability of Anisotropically Conductive Film (ACF)Yim, M.-J. / Paik, K.-W. et al. | 1999
- 174
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Evaluation of Closed-Form Crosstalk Models of Coupled Transmission LinesShi, W. / Fang, J. et al. | 1999
- 182
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Influence of a Floating Plane on Effective Ground Plane Inductance in Multilayer and Coplanar PackagesLopez, M. / Prince, J. L. / Cangellaris, A. C. et al. | 1999
- 189
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Processing Thick Multilevel Polyimide Films for 3-D Stacked MemoryCaterer, M. D. / Daubenspeck, T. H. / Ference, T. G. et al. | 1999
- 200
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On Resonant Effects in Multilayer RF/Microwave Printed Circuit Board ApplicationsGeorgieva, N. / Chen, Z. / Oberhammer, W. et al. | 1999
- 207
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Packaging-Compatible High Q Microinductors and Microfilters for Wireless ApplicationsPark, J. Y. / Allen, M. G. et al. | 1999
- 214
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Surface Graft Copolymerization Enhanced Adhesion of an Epoxy-Based Printed Circuit Board Substrate (FR-4) to CopperLiu, Y. X. / Kang, E. T. / Neoh, K. G. et al. | 1999
- 221
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Frequency Response Characteristics of Reference Plane Effective Inductance and ResistanceXie, X. / Prince, J. L. et al. | 1999
- 221
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Frequency response characteristics of reference plane effective inductance and resistance (IC packaging)Xie, Xuebing / Prince, J.L. et al. | 1999