IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 202
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Very high density interconnect elastomer chip socketsNorberg, G. / Dejanovic, S. / Hesselbom, H. et al. | 2006
- 211
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Novel method for simultaneous formation of wires and vias of a printed circuit board using nanoporous bodyAsakawa, K. / Matake, S. / Hotta, Y. et al. | 2006
- 218
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Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) methodShigetou, A. / Itoh, T. / Matsuo, M. et al. | 2006
- 227
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The development of Cu bonding wire with oxidation-resistant metal coatingKaimori, S. / Nonaka, T. / Mizoguchi, A. et al. | 2006
- 232
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Novel process warpage modeling of matrix stacked-die BGAXueren Zhang, / Tong Yan Tee, / Jiang Zhou, et al. | 2006
- 240
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Handheld use condition-based bend test developmentMercado, L.L. / Phillips, B. / Sahasrabudhe, S. et al. | 2006
- 250
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A general method for the connection of a component thermal model to a boardXiaoming Guo, / Celo, D. / Walkey, D.J. et al. | 2006
- 264
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Comprehensive dynamic analysis of wirebonding on Cu/low-K wafersChang-Lin Yeh, / Yi-Shao Lai, et al. | 2006
- 271
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Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packagesGuang-Ming Zhang, / Harvey, D.M. / Braden, D.R. et al. | 2006
- 284
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Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAsTong Yan Tee, / Hun Shen Ng, / Zhaowei Zhong, et al. | 2006
- 291
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Direct fabrication of electric components on insulated boards by laser microcladding electronic pastesXiaoyan Zeng, / Xiangyou Li, / Jingwei Liu, et al. | 2006
- 295
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A novel aluminum-filled composite dielectric for embedded passive applicationsJianwen Xu, / Kyoung-Sik Moon, / Tison, C. et al. | 2006
- 307
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50-GHz integrated interconnects in silicon optical microbench technologyBanerjee, S.R. / Drayton, R.F. et al. | 2006
- 314
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Effects of microstructural defects in multilayer LTCC striplineJang, J.H. / Ishitobi, N. / Kim, B.C. et al. | 2006
- 320
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An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductancesChen Wang, / Jingkun Mao, / Selli, G. et al. | 2006
- 335
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Modeling and analyzing vertical interconnectionsMantysalo, M. / Ristolainen, E.O. et al. | 2006
- 343
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Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packagingLiao, E.B. / Tay, A.A.O. / Ang, S.S. et al. | 2006
- 354
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A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceiversZhang, Y.P. / Li, X.J. / Phang, T.Y. et al. | 2006
- 359
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Signal integrity characterization of microwave XFP ASIC BGA package realized on low-K liquid crystal polymer (LCP) substrateYazdani, F. et al. | 2006
- 364
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Cost-effective chip-on-heat sink leadframe package for 800-Mb/s/lead applicationsChen, N. / Hongchin Lin, / Jeng-Yuan Lai, et al. | 2006
- 372
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CORRESPONDENCE - Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package"Lee, T.K. et al. | 2006
- 372
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Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package"Lee, T.K. / Zhang, S. / Wong, C.C. et al. | 2006
- 373
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ANNOUNCEMENTS - 2nd Annual Organic Microelectronics Workshop (ACS-IEEE-MRS)| 2006
- 373
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2nd Annual Organic Microelectronics Workshop (ACS/IEEE/MRS)| 2006
- 374
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ANNOUNCEMENTS - Call for Papers: 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006)| 2006
- 374
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15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006)| 2006
- 375
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8th Electronics Packaging Technology Conference (EPTC 2006)| 2006
- 375
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ANNOUNCEMENTS - Call for Papers: 8th Electronics Packaging Technology Conference (EPTC 2006)| 2006
- 376
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56th Electronic Components and Technology Conference (ECTC 2006)| 2006
- 376
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ANNOUNCEMENTS - 56th Electronic Components and Technology Conference (ECTC 2006)| 2006
- 377
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Order Form for Reprints| 2006
- 378
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IEEE Transactions on Components and Packaging Technology table of contents| 2006
- 380
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IEEE Transactions on Electronics Packaging Manufacturing table of contents| 2006
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Table of contents| 2006
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IEEE Transactions on Advanced Packaging publication information| 2006
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2006
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2006