IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 164
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Foreword additional contributions from the 49th electronic components and technology conferenceKrusius, J.P. / Watkins, L.S. et al. | 2000
- 197
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Foreword contributions from TC- 18 wafer scale packaging [Guest Editor]Garrou, P. et al. | 2000
- 257
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A novel robust and low cost chips package and its thermal performanceCho, Soon-Jin / Park, Sang-Wook / Park, Myung-Guen et al. | 2000
- 266
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Application of the Taguchi method to chip scale package (CSP) designMertol, A. et al. | 2000
- 277
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Effect of randomness of Cu-Sn intermetallic compound layer thickness on reliability of surface mount solder jointsHuang, W. / Palusinski, O.A. / Dietrich, D.L. et al. | 2000
- 293
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A study of the high frequency performance of thin film capacitors for electronic packagingChen, K.Y. / Brown, W.D. / Schaper, L.W. et al. | 2000
- 313
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Factors influencing the permittivity of polymer/ceramic composites for embedded capacitorsOgitani, S. / Bidstrup-Allen, S.A. / Kohl, P.A. et al. | 2000