IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 4
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Silver Metallization for Advanced InterconnectsManepalli, R. / Stepniak, F. / Bidstrup-Allen, S. A. et al. | 1999
- 9
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An Efficient Solver for the Three-Dimensional Capacitance of the Interconnects in High Speed Digital Circuit by the Multiresolution Method of MomentsZheng, J. / Li, Z.-F. / Qian, X.-N. et al. | 1999
- 16
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High Frequency Loss and Electromagnetic Field Distribution for Striplines and MicrostripsLo, H. L. / Kauffman, J. F. / Franzon, P. D. et al. | 1999
- 16
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High frequency loss and electromagnetic field distribution for striplines and microstrips (MCM packages)Lo, H.L. / Kauffman, J.F. / Franzon, P.D. et al. | 1999
- 26
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Accurate High Speed Empirically Based Predictive Modeling of Deeply Embedded Gridded Parallel Plate Capacitors Fabricated in a Multilayer LTCC ProcessPoddar, R. / Brooke, M. A. et al. | 1999
- 32
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Parameter Extraction and Electrical Characterization of High Density Connector Using Time Domain MeasurementsPannala, S. / Haridass, A. / Swaminathan, M. et al. | 1999
- 40
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A Very Thin Power Amplifier Multichip Module for 1.9-GHz Cellular Phone SystemsKagaya, O. / Sekine, K. / Yamashita, K. et al. | 1999
- 46
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Novel Thermally Reworkable Underfill Encapsulants For Flip-Chip ApplicationsWang, L. / Wong, C. P. et al. | 1999
- 54
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Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic PackagingWong, C. P. / Bollampally, R. S. et al. | 1999
- 60
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Lifetime Resistance Model of Bare Metal Electrical ContactsSun, M. / Pecht, M. G. / Natishan, M. A. E. et al. | 1999
- 68
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Characterization and Performance Prediction for Integral Capacitors in Low Temperature Co-Fired Ceramic TechnologyDelaney, K. / Barrett, J. / Barton, J. et al. | 1999
- 78
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Characterization and Performance Prediction for Integral Resistors in Low Temperature Co-Fired Ceramic TechnologyDelaney, K. / Barrett, J. / Barton, J. et al. | 1999
- 86
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Quantitative Characterization of 96.5Sn3.5Ag and 80Au20Sn Optical Fiber Solder Bond Joints on Silicon Micro-Optical Bench SubstratesRassaian, M. / Beranek, M. W. et al. | 1999
- 94
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Crack Formation Mechanism in Laser-Welded Au-Coated Invar Materials for Semiconductor Laser PackagingKuang, J.-H. / Sheen, M.-T. / Wang, S.-C. et al. | 1999