IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 418
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Foreword contributions from the 50th electronic components and technology conferenceBoudreau, R. et al. | 2001
- 419
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Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical benchIwase, M. / Nomura, T. / Izawa, A. et al. | 2001
- 429
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Packaging technology for 40-Gb/s optical receiver module with an MU-connector interfaceIwasaki, N. / Yanagibashi, M. / Tsunetsugu, H. et al. | 2001
- 434
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Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgyPittroff, W. / Erbert, G. / Beister, G. et al. | 2001
- 442
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High performance selectively oxidized VCSELs and arrays for parallel high-speed optical interconnectsMederer, F. / Ecker, I. / Joos, J. et al. | 2001
- 450
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Methods for passive fiber chip coupling of integrated optical devicesHauffe, R. / Siebel, U. / Petermann, K. et al. | 2001
- 456
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Advances in multichannel MultiGbytes/s bit-parallel WDM single fiber linkBergman, L.A. / Yeh, C. / Morookian, J. et al. | 2001
- 463
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ForewordElshabini, A. et al. | 2001
- 464
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Packaging technology for high performance CMOS server Fujitsu GS8900Fujisaki, A. / Suzuki, M. / Yamamoto, H. et al. | 2001
- 470
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High performance package designs for a 1 GHz microprocessorHasan, A. / Sarangi, A. / Baldwin, C.S. et al. | 2001
- 477
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Single level integrated packaging modules for high performance electronic systemsLi-Rong Zheng, / Tenhunen, H. et al. | 2001
- 486
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Aging studies of PBGA solder joints reflowed at different conveyor speedsFan, S.H. / Chan, Y.C. / Tang, C.W. et al. | 2001
- 493
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Reaction of solder with Ni/Au metallization for electronic packages during reflow solderingHo, C.E. / Tsai, S.Y. / Kao, C.R. et al. | 2001
- 499
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Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA modelsPang, J.H.L. / Chong, D.Y.R. et al. | 2001
- 507
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Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliabilityPang, J.H.L. / Kar Hwee Ang, / Shi, X.Q. et al. | 2001
- 515
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Interconnections based on Bi-coated SnAg solder ballsKorhonen, T.-M. / Vuorinen, V. / Kivilahti, J.K. et al. | 2001
- 521
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Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit boardYoung-Soo Sohn, / Jeong-Cheol Lee, / Hong-June Park, et al. | 2001
- 528
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A hybrid 2-D ADI-FDTD subgridding scheme for modeling on-chip interconnectsBing-Zhong Wang, / Yingjun Wang, / Wenhua Yu, et al. | 2001
- 534
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Electrical characterization of a 500 MHz frequency EBGA packageHamano, T. / Ikemoto, Y. et al. | 2001
- 542
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Complete methodology for electrical modeling of RFIC packagesTzyy-Sheng Horng, / Sung-Mao Wu, / Shih, C. et al. | 2001
- 548
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Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packagesTzyy-Sheng Horng, / Sung-Mao Wu, / Chi-Tsung Chiu, et al. | 2001
- 555
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Optimal shapes of fully embedded channels for conjugate coolingFisher, T.S. / Torrance, K.E. et al. | 2001
- 563
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Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packagesJao-Hwa Kuang, / Maw-Tyan Sheen, / Chang, C.-F.H. et al. | 2001
- 569
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Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumpsSasaki, J. / Itoh, M. / Tamanuki, T. et al. | 2001
- 576
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Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cyclingBeranek, M.W. / Rassaian, M. / Tang, C.-H. et al. | 2001
- 586
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Microfixtured assembly for lensed optoelectronic receiversYap, D. / Au, A. / Kendall, L.K. et al. | 2001
- 590
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The evolution of passive devices in WDM networksJanssen, A. et al. | 2001
- 595
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Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnectsSutono, A. / Cafaro, N.G. / Laskar, J. et al. | 2001
- 604
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Author index| 2001
- 608
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Subject index| 2001